Protection Layer for Display Transistor Etch Prevention

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Solution Overview

Problem

Current display devices face challenges in optimizing the structure of light-emitting diodes and transistors to prevent damage during the manufacturing process, particularly due to the formation of cavities in the inter-insulating layer which can lead to etchant penetration and transistor damage.

Innovation Solution

Incorporating a protection layer with insulating and conductive sub-layers that overlap crossing regions between semiconductor layers and electrodes, acting as an etch stopper to prevent cavity formation and protect the semiconductor layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the inter-insulating layer structure is simplified for ease of manufacture, then manufacturing complexity is reduced, but cavities form during manufacturing which lead to etchant penetration and transistor damage

Engineering Contradiction:
Improveease of manufactureVSAvoidtransistor integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The protection layer is formed in advance before the etching process to prevent cavity formation. By placing the protection layer at the crossing regions between the semiconductor layer and electrode before manufacturing steps are completed, the structure is pre-protected against potential etchant penetration and damage during subsequent manufacturing processes.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The protection layer acts as an intermediary element between the semiconductor layer and the electrode. This intermediate layer prevents direct interaction between the etchant and the semiconductor layer at crossing regions, mediating the potential harmful effects during the manufacturing process while maintaining the electrical connection functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the protection layer is added to prevent etchant penetration, then transistor integrity is improved, but device structure complexity increases

Engineering Contradiction:
Improvetransistor integrityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protection layer is applied locally only at the crossing regions where the semiconductor layer intersects with the electrode, rather than covering the entire device structure. This localized approach provides necessary protection at critical points while minimizing the overall increase in device complexity and maintaining manufacturing efficiency.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The protection layer is segmented into specific regions corresponding to the crossing points between semiconductor layers and electrodes. Rather than a continuous layer across the entire device, the protection layer is divided into discrete segments at where they are needed, reducing unnecessary structural complexity while maintaining protective functionality.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11948516B2Display device
Publication Date: 2024.04.02 SAMSUNG DISPLAY CO LTD
  • US11948516B2 patent drawing
  • US11948516B2 patent drawing
  • US11948516B2 patent drawing

AI summary

A display device includes a driving voltage line and a plurality of data lines extending in a first direction, a first driving transistor electrically connected to the driving voltage line, a first switching transistor electrically connected to the first driving transistor and including a first switching semiconductor layer extending in a second direction crossing the first direction and a first switching gate electrode overlapping a channel region of the first switching semiconductor layer, and a first storage capacitor electrically connected to the first driving transistor and the first switching transistor, where the first switching semiconductor layer is electrically connected to a first data line, the first switching semiconductor layer crosses a second data line between the channel region and the first data line, and a crossing region of an edge of the first switching semiconductor layer and an edge of the second data line overlaps a first protection layer.