Display Device Undercut Barrier Layer Uniformity
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Solution Overview
Problem
The challenge in display device manufacturing is to achieve thin-film transistors (TFTs) with uniform thickness and prevent contamination of semiconductor patterns, which is crucial for maintaining high display quality and efficiency.
Innovation Solution
The solution involves a display device structure with a substrate, gate electrode, semiconductor pattern, data wiring, and barrier layers, including molybdenum oxide and Mo areas, where undercuts are formed in the molybdenum oxide areas, and a manufacturing method that involves forming a first and second barrier layer, oxidizing the substrate, and partially removing the molybdenum oxide layer to achieve uniform semiconductor pattern heights and prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used, then production efficiency is maintained, but semiconductor pattern thickness uniformity deteriorates
Solution Approach 1:
The patent applies preliminary action by forming a barrier layer with undercuts before depositing the semiconductor material. This pre-structured barrier layer with recessed regions guides the semiconductor deposition process, ensuring uniform thickness from the beginning rather than requiring post-processing adjustments, thus maintaining both precision and efficiency
Solution Approach 2:
The barrier layer acts as an intermediary structure between the substrate and the semiconductor pattern. The undercuts in the barrier layer serve as a mediating feature that controls semiconductor material distribution, enabling uniform thickness through the intermediary structure rather than direct deposition on the substrate
2Object-affected harmful factors
If additional barrier layers and undercuts are added, then contamination prevention is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the barrier layer structure. The barrier layer simultaneously serves as a protective layer preventing contamination, a structural element with undercuts for thickness control, and a guiding feature for semiconductor deposition. This consolidation reduces the number of separate components needed
Solution Approach 2:
The undercuts are strategically positioned only in specific regions of the barrier layer where contamination risk is highest and thickness control is needed. This localized feature addition prevents unnecessary complexity throughout the entire device structure, applying complexity only where beneficial
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform distribution and excellent properties of TFTs by maintaining consistent semiconductor pattern heights and preventing contamination, thereby enhancing the performance and reliability of the display device.
Implementation Method 1
oxidizing the substrate; forming a molybdenum oxide layer on a segment of the first barrier layer corresponding to the channel portion
Data Source
AI summary
A display device and a method of manufacturing the display device are provided. According to an exemplary embodiment, a display device includes: a substrate; a gate electrode disposed on the substrate; a semiconductor pattern disposed on the gate electrode; data wiring disposed on the semiconductor pattern and having a data line, a source electrode, and a drain electrode; a first barrier layer disposed between the data wiring and the semiconductor pattern; and undercuts disposed on at least one side of each segment of the first barrier layer.