Display Unit Layered Structure for High-Definition Micro-LED Transfer
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Solution Overview
Problem
The time-consuming process of mounting micro LEDs on display units, particularly as pixel count increases, leads to high manufacturing costs and difficulty in achieving high definition and reliability, with existing methods like pick-and-place being inefficient.
Innovation Solution
A display unit structure comprising transistors, conductive layers, and insulating layers with precise bonding and alignment, allowing for the direct attachment of light-emitting diodes without requiring high positioning precision, and utilizing a method that forms and separates substrates to create a matrix of light-emitting diodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pick-and-place method is used to mount LED chips one by one, then the display unit can be manufactured with individual LED placement, but the manufacturing time becomes extremely long and manufacturing cost increases
Solution Approach 1:
The patent segments the manufacturing process into two independent stages: (1) mass formation of LED chips on a first substrate, and (2) transfer to the second substrate. This segmentation allows parallel processing and eliminates the sequential one-by-one mounting bottleneck, resolving the contradiction between placement precision and manufacturing speed.
Solution Approach 2:
The patent performs preliminary actions by pre-forming multiple LED chips on the first substrate before transfer, and pre-preparing the second substrate with conductive patterns. This preliminary preparation enables batch processing and significantly reduces the time required during the actual mounting phase, addressing the productivity issue while maintaining precision.
2Manufacturing precision
If the number of pixels and LEDs increases to achieve higher definition, then the display quality improves, but the mounting time and difficulty increase significantly
Solution Approach 1:
The patent merges multiple LED mounting operations into a single batch transfer process. By transferring arrays of LED chips simultaneously from the first substrate to the second substrate using conductive adhesive patterns, the method achieves high-definition displays with many pixels without proportionally increasing mounting time, thus resolving the contradiction between display quality and time consumption.
3Reliability
If individual LED mounting is performed to ensure proper electrical connection, then the reliability of electrical connection is maintained, but the manufacturing process becomes extremely time-consuming
Solution Approach 1:
The patent introduces a conductive adhesive layer as an intermediary between the LED chip electrodes and the substrate conductive patterns. This intermediary enables simultaneous electrical connection of multiple LEDs during batch transfer, maintaining connection reliability while dramatically improving manufacturing efficiency compared to individual wire bonding or soldering processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-definition, high-resolution displays with reduced manufacturing costs and improved reliability, utilizing micro LEDs with low power consumption and extended lifetime, suitable for wearable devices and other small display applications.
Implementation Method 1
The first insulating layer and the second insulating layer are directly bonded to each other
Data Source
AI summary
A display unit with a high definition is provided. The display unit includes a transistor, a light-emitting diode, a first conductive layer, a second conductive layer, a first insulating layer, and a second insulating layer. The transistor is electrically connected to the first conductive layer, and the first conductive layer and the first insulating layer are positioned over the transistor. The second conductive layer is positioned over the first conductive layer. The second insulating layer is positioned over the first insulating layer. The light-emitting diode includes a first electrode over the second insulating layer, a light-emitting layer over the first electrode, and a second electrode over the light-emitting layer. The second electrode is electrically connected to the second conductive layer. The height of a surface of the first conductive layer on the second conductive layer side is substantially the same as the height of a surface of the first insulating layer on the second insulating layer side. The first insulating layer and the second insulating layer are directly bonded to each other. The second conductive layer is positioned in an opening in the second insulating layer and is electrically connected to the first conductive layer.