Display Device Via Hole Pad Connection Heat Dissipation
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Solution Overview
Problem
Current display devices, particularly those used in head-mounted displays for virtual and augmented reality, face challenges in achieving ultrahigh resolution and efficient heat dissipation while maintaining a simplified connection structure between circuit boards and substrates.
Innovation Solution
The design incorporates a circuit substrate with pixel circuit units and pads, a display substrate with light-emitting elements and via holes for connecting electrodes, a circuit board with pads, and a heat dissipation substrate, allowing for electrical connection via pad connecting electrodes and facilitating heat release through a stacked structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional connection structure between circuit board and substrate is used, then the fabrication process becomes complex, but the connection reliability is maintained
Solution Approach 1:
The patent merges the connection structure by integrating the circuit board directly with the substrate through shared via holes and pad connecting electrodes. The circuit board pads are positioned to align with substrate pads, and pad connecting electrodes in the via holes establish electrical connections between them, eliminating the need for separate complex connection components and simplifying the overall fabrication process.
2Temperature
If multiple separate layers are used for light-emitting elements and circuit connections, then the electrical connection is reliable, but the heat dissipation efficiency is reduced
Solution Approach 1:
The patent combines the light-emitting element layers and circuit connection layers into a single integrated substrate structure. The via holes penetrate through the light-emitting element layers (first semiconductor layer, active layer, second semiconductor layer) to reach the circuit board pads, allowing heat generated by the light-emitting elements to be conducted directly to the circuit board and heat dissipation substrate, thereby improving heat dissipation efficiency while maintaining structural integration.
3Device complexity
If the via holes are positioned to align with pads, then the electrical connection is simplified, but the manufacturing precision requirement increases
Solution Approach 1:
The patent employs preliminary alignment actions during the fabrication process. The via holes are positioned to correspond to the pads in advance, and the circuit board pads are arranged to match the via hole positions. This preliminary positioning ensures that the pad connecting electrodes can be accurately formed in the via holes to connect the circuit board pads and substrate pads, simplifying the overall connection structure while managing manufacturing precision requirements through planned alignment.
Data Source
AI summary
A display device is provided. The display device incudes a circuit substrate including pixel circuit units, and pads electrically connected to the pixel circuit units, a display substrate above the circuit substrate, including light-emitting elements electrically connected to the pixel circuit units, and defining via holes in a peripheral area around a cell part where the light-emitting elements are located, a circuit board above the display substrate, and including circuit board pads electrically connected to the pads, a heat dissipation substrate below the circuit substrate, and pad connecting electrodes in the via holes, and connected to the pads of the circuit substrate and to the circuit board pads of the circuit board.