Display Via Structure With Light Filtering for High Aperture Ratio
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display devices face a challenge in maintaining a high aperture ratio and display quality due to color mixing of light at large viewing angles, which is often mitigated by light shielding structures that reduce pixel aperture.
Innovation Solution
An electronic device structure featuring a substrate, circuit layer, light filtering layer, organic insulating layer, and transparent conductive layer, where the light filtering layer has a via with a discontinuous sidewall and a narrower width than the corresponding via in the organic insulating layer, reducing light leakage and improving display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light shielding structure is disposed in the interface area of the light filtering layer to prevent color mixing, then display quality is improved, but the aperture ratio of the pixels is reduced
Solution Approach 1:
The patent extracts the light shielding function from a separate black matrix layer and integrates it into the light filtering layer itself through the discontinuous sidewall structure. This eliminates the need for additional light shielding structures that would occupy pixel aperture, while still achieving the color mixing prevention function.
Solution Approach 2:
The discontinuous sidewall structure creates local light shielding properties only at the interface area where color mixing occurs, while the rest of the pixel area maintains full transparency. This localized approach prevents color mixing without reducing the overall aperture ratio.
2Reliability
If the light filtering layer has a discontinuous sidewall structure with narrower width, then light leakage is reduced and display quality is improved, but the manufacturing precision requirements are increased
Solution Approach 1:
The via structure is segmented into two distinct parts: a first via in the organic insulating layer and a second via in the light filtering layer. The second via has a narrower width and discontinuous sidewall, creating segmented light control zones that reduce light leakage while the segmentation itself provides manufacturing tolerance through the stepped structure.
Solution Approach 2:
The patent introduces a vertical dimension to the via structure with the discontinuous sidewall, creating a stepped configuration. This dimensional change allows the via to have different widths at different heights, providing light control in the vertical dimension while maintaining larger horizontal aperture.
Data Source
AI summary
An electronic device including a substrate, a circuit layer, a light filtering layer, an organic insulating layer and a transparent conductive layer is provided by the present disclosure. The circuit layer is disposed on the substrate. The light filtering layer is disposed on the circuit layer and has a first via. The organic insulating layer is disposed on the light filtering layer and has a second via, wherein the second via is corresponding to the first via. The transparent conductive layer is electrically connected to the circuit layer through the first via and the second via. The first via has a first sidewall, the second via has a second sidewall, the first sidewall and the second sidewall are not continuous, and a width of the first via is less than a width of the second via.