Display Vias for Rear-Mounted Circuit Attachment

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Solution Overview

Problem

In compact electronic devices, the inclusion of driver circuitry and attachment structures for flexible printed circuit cables leads to larger border regions in displays, which is undesirable for thin display designs.

Innovation Solution

The use of vias formed in the display substrate layer, filled with conductive material, allows for the mounting of components like flexible printed circuits and integrated circuits on the rear surface, eliminating the need for front-surface attachments and minimizing border regions by routing signals through the rear surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If driver circuitry is mounted on the front surface of the display using a ledge structure, then the driver integrated circuit can be properly attached and connected, but the border region of the display becomes larger than desired

Engineering Contradiction:

Improvedriver circuit attachmentVSAvoiddisplay border region

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent inverts the conventional mounting approach by relocating the driver circuitry from the front surface ledge to the rear surface of the display. This inversion allows the driver integrated circuit to be mounted on contacts formed on the rear surface, eliminating the need for front-surface ledge structures and thereby reducing the display border region.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions the mounting location from the front surface (two-dimensional plane) to the rear surface (another dimension/space). By forming contacts through the substrate layer and mounting the driver circuitry on the rear surface, the solution utilizes a different spatial dimension to resolve the border region issue.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If flexible printed circuit cables are attached to the display using attachment structures, then electrical connections can be established, but more area is consumed than desired

Engineering Contradiction:

Improveelectrical connectionVSAvoidattachment structure area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent inverts the attachment location by moving the connection point from the front surface to the rear surface. Flexible printed circuit cables are attached to contacts on the rear surface of the display, eliminating the need for front-surface attachment structures and reducing the area consumed by these components.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The solution moves the attachment structures to another dimension (the rear surface) rather than occupying space on the front surface. This spatial reorganization allows electrical connections to be established without consuming valuable front-surface area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If driver circuitry is integrated into the display structure, then compactness can be improved, but the border region becomes larger due to attachment requirements

Engineering Contradiction:

Improvedisplay compactnessVSAvoidborder region

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent resolves the compactness-border region contradiction by inverting the integration approach. Instead of adding front-surface ledge structures for driver circuitry, the driver circuitry is integrated into the rear surface structure, allowing compact design without increasing the visible border region.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes the inactive border regions on the display's front surface, allowing for a larger active area for pixel arrays and reducing the size of the border, thereby enhancing the display's compactness and efficiency.

Implementation Method 1

Vias may be formed in a display substrate layer by laser drilling or other via hole formation techniques

Methodology Applied

Scientific EffectLaser drilling: Laser Ablation

Implementation Method 2

The vias may be filled with a conductive material such as metal using electroplating or other metal deposition techniques

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10522072B2Display with vias for concealed printed circuit and component attachment

Publication Date: 2019.12.31 APPLE INC

AI summary

An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.