Display Electrode Via Layout to Prevent Short-Circuit Steps

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Solution Overview

Problem

Display devices face challenges in preventing short-circuits between adjacent electrodes, particularly due to step differences in via holes which can lead to electrical connections between intended separate electrodes.

Innovation Solution

The implementation of a bank extension portion that overlaps a via hole disposed between connection electrodes, reducing the step difference and preventing short-circuit defects by ensuring proper electrical isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a via hole is formed to connect electrodes, then electrical connection is achieved, but step difference causes short-circuit between adjacent electrodes

Engineering Contradiction:

Improveelectrical isolationVSAvoidstep difference control

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

An insulating layer is introduced as an intermediary substance between the via hole and adjacent electrodes. This insulating layer fills the via hole and extends beyond it, creating a physical barrier that prevents direct contact between adjacent electrodes while maintaining the electrical connection function of the via hole.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution transitions from a two-dimensional planar structure to a three-dimensional structure by filling the via hole with insulating material and extending it vertically. This dimensional change allows the insulating layer to bridge the gap between different levels, effectively eliminating the step difference problem.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Strength

If via hole depth is increased to improve connection, then electrical connection strength improves, but step difference increases causing short-circuit risk

Engineering Contradiction:

Improveelectrical connection strengthVSAvoidshort-circuit risk

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The via hole structure, which initially causes harm through step difference and short-circuit risk, is converted into a beneficial structure by filling it with insulating material. The same deep via hole that caused problems now serves as a container for the insulating layer, transforming the harmful step difference into a protected electrical connection.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS12334486B2Display device and method of manufacturing the same

Publication Date: 2025.06.17 SAMSUNG DISPLAY CO LTD

AI summary

A display device includes a conductive pattern on a substrate, a via layer on the conductive pattern with a via hole exposing the conductive pattern, a first electrode and a second electrode on the via layer and spaced apart from each other, a first insulating layer on the first electrode and the second electrode, a bank layer on the first insulating layer defining an emission area and a subarea, a light-emitting element on the first insulating layer, and a first connection electrode and a second connection electrode on the first insulating layer and the light-emitting element. The first connection electrode electrically contacts an end of the light-emitting element, and the second connection electrode electrically contacts another end of the light-emitting element. The bank layer includes a bank extension portion extended to the subarea and the bank extension portion overlaps at least a portion of the via hole.