Display Panel Via-Hole Relief Structure for Packaging Layer Integrity
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Solution Overview
Problem
The manufacturing process of hole digging screens with small hole diameters faces challenges such as stress imbalance and thermal effects during laser cutting, leading to peeling of the packaging layer and reduced production yield due to stress imbalance and thermal effects, which can cause poor packaging and product defects.
Innovation Solution
The introduction of relief structures around the via hole, including specific configurations of relief structures, anti-crack dams, and flow stop dams, enhances bonding strength and prevents crack propagation, ensuring robust packaging by increasing contact area and using materials with high ductility to manage stress and thermal effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If laser cutting is used to create via holes in hole digging screens, then the screen-to-body ratio is improved, but stress imbalance and thermal effects cause peeling of the packaging layer
Solution Approach 1:
The patent divides the relief structure into multiple segments including a first relief structure, second relief structure, third relief structure, and fourth relief structure arranged around the via hole. This segmentation allows stress to be distributed across multiple zones, preventing concentrated stress that would cause packaging layer peeling while maintaining the via hole's light-blocking function.
Solution Approach 2:
The patent introduces relief structures with specific geometric configurations (such as arch-shaped or curved designs) at specific locations around the via hole. These localized structural modifications create zones with different mechanical properties, allowing the packaging layer to better accommodate thermal expansion and stress variations in critical areas without compromising the overall screen structure.
2Shape
If small hole diameter via holes are used to improve immersion experience, then the aesthetic quality is improved, but manufacturing precision deteriorates due to stress imbalance during laser cutting
Solution Approach 1:
The patent introduces relief structures around the via hole before the laser cutting process. These pre-formed structural features serve as stress compensation zones that prevent stress imbalance during the actual cutting of small-diameter via holes, thereby maintaining manufacturing precision even when cutting very small holes that require high precision.
Solution Approach 2:
The relief structures are designed with asymmetric or varied geometric configurations (such as arch-shaped structures with different radii or curved patterns) rather than uniform symmetric designs. This asymmetric design allows for better stress distribution around the small via hole, preventing cutting deviation and maintaining precision in the manufacturing of small-diameter holes.
3Strength
If relief structures are added around the via hole to prevent peeling, then bonding strength is improved, but device complexity increases
Solution Approach 1:
The patent integrates the relief structures with the existing substrate structure rather than adding them as separate components. The relief structures are formed as part of the substrate's relief pattern, merging the stress-compensation function with the existing structural framework, thereby enhancing bonding strength without proportionally increasing overall device complexity.
Solution Approach 2:
The relief structures are designed with curved or arch-shaped geometries that naturally distribute stress more effectively than sharp angular designs. These curved structures provide superior bonding strength and stress resistance while requiring relatively simple manufacturing processes, thus improving strength without excessive complexity increase.
Data Source
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AI summary
Provided are a display panel and a display device. The display panel comprises: a via hole penetrating through the display panel; a cutting residual area, which is located on the periphery of the via hole and comprises a base substrate, and a packaging layer located on one side of the base substrate; and at least one annular relief structure located between the packaging layer and the base substrate of the cutting residual area. The at least one annular relief structure is sequentially distributed around the via hole. The smallest distance between a first relief structure and the outer edge of the via hole is 0-30 micrometers. At least one relief structure is provided with a surface facing away from the base substrate, and a side face connected to the surface, wherein at least one of the surface and the side face is of a relief shape. The first relief structure is the relief structure, the distance from which to the center of the via hole is the smallest.