Display Panel Wiring Structure for Narrow-Bezel Cutting Reliability
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Solution Overview
Problem
The development of electronic devices with narrow frame display panels faces challenges in manufacturing due to miniaturized wire line widths and spacings, leading to increased difficulty and risk of wire damage during substrate cutting, which affects the performance and reliability of the finished product.
Innovation Solution
A wiring structure design featuring a substrate with a first conductive layer, an insulating layer, and a second conductive layer, where the second conductive layer covers an equal number of first and second connection wires, reducing voltage polarity interference and protecting the wires from damage, especially in reduced line spacing configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the line width and line spacing of wires are miniaturized to meet narrow frame design requirements, then the area of the peripheral region is reduced, but the manufacturing difficulty increases and wires are prone to damage during substrate cutting
Solution Approach 1:
The patent introduces a protective conductive layer structure that extends in the vertical dimension (stacked layers) to protect the miniaturized wires. Instead of increasing horizontal spacing, the solution uses vertical layering with insulating and protective conductive layers to shield the fan-out wires from damage during cutting while maintaining the reduced peripheral area.
Solution Approach 2:
The patent applies a protective conductive layer structure over the fan-out wires before the substrate cutting process. This preliminary protective action prevents wire damage during subsequent cutting operations, allowing the wires to be miniaturized without compromising their integrity during manufacturing.
2Area of stationary object
If the line width and line spacing of wires are miniaturized to meet narrow frame design requirements, then the area of the peripheral region is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent resolves the manufacturing complexity issue by transitioning to vertical layering. The protective structure uses stacked conductive and insulating layers in the vertical dimension, which simplifies the horizontal manufacturing process while achieving the same protective function, thus reducing overall manufacturing complexity despite miniaturization.
3Area of stationary object
If the wiring position overlaps with the scribe line, then the peripheral area is minimized, but the wires are prone to damage when cutting the substrate
Solution Approach 1:
The patent applies a protective conductive layer structure over the wires that overlap with the scribe line before cutting. This preliminary protective measure ensures that even though the wires are positioned over the cutting line to minimize peripheral area, they remain protected from damage during the substrate cutting process.
Solution Approach 2:
The protective conductive layer structure acts as a cushioning layer that absorbs or prevents damage to the underlying wires during substrate cutting. This beforehand cushioning allows the wires to be positioned over the scribe line without compromising their integrity during the cutting process.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a first conductive layer, an insulating layer, and a second conductive layer. The first conductive layer is disposed on the substrate. The first conductive layer has a first connection wire and a second connection wire. In a cycle, the first connection wire transmits a positive polarity signal and the second connection wire transmits a negative polarity signal. The insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the insulating layer. The second conductive layer includes a plurality of portions covering the first connection wire and the second connection wire. In addition, the number of first connection wire covered by each of the plurality of portions is equal to the number of second connection wire covered by each of the plurality of portions.