Display Module Wiring Layout to Hide Interpixel Conductors
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Solution Overview
Problem
The visibility of wiring between pixels in display modules leads to image quality deterioration, and the use of Photo Solder Resist (PSR) in black adds extra process and cost.
Innovation Solution
A display module with a novel wiring structure where wiring members are strategically positioned on the substrate's surface, avoiding visibility and eliminating the need for a PSR, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring is disposed between the plurality of pixels, then electrical connection is achieved, but the wiring becomes visible and image quality deteriorates
Solution Approach 1:
The patent applies dimensionality change by routing wiring members through the thickness direction of the substrate rather than disposing them on the surface. Wiring members extend from the rear surface through via holes to the front surface, utilizing the third dimension (depth) to hide conductors from the viewer's perspective while maintaining electrical connectivity between pixels.
Solution Approach 2:
The patent implements nesting by placing wiring members inside via holes that penetrate the substrate. The wiring members are nested within the substrate thickness, with insulating layers surrounding them, effectively hiding the conductive elements within the substrate's internal structure rather than exposing them on the surface.
2Object-affected harmful factors
If Photo Solder Resist (PSR) in black is applied to cover the wiring, then wiring visibility is reduced, but extra process and additional cost are required
Solution Approach 1:
The patent extracts the wiring members from the visible surface plane and relocates them to the substrate's interior through via holes. This extraction eliminates the need for PSR coating entirely, as the wiring members are naturally hidden within the substrate structure, removing the additional manufacturing process and associated costs.
3Reliability
If wiring members are disposed on the front surface of the substrate, then electrical connection is achieved, but the wiring members are visible and require PSR coverage
Solution Approach 1:
The patent transitions wiring member placement from the two-dimensional surface plane to the three-dimensional interior space of the substrate. Wiring members are positioned within via holes that extend through the substrate thickness, utilizing the depth dimension to conceal conductors while maintaining front-surface electrical connectivity through via hole terminals.
Data Source
AI summary
A display is provided. The display includes a first substrate comprising a plurality of electrode pads disposed on a front surface, a plurality of solder members disposed on a rear surface, and a plurality of wiring members electrically connecting the plurality of electrode pads and the plurality of solder members, respectively, a plurality of light-emitting elements electrically connected to each of the plurality of electrode pads, and constituting pixels of two columns, and a second substrate comprising a thin film transistor (TFT) layer disposed on a rear side of the first substrate and electrically connected to the plurality of solder members to control driving of the plurality of light-emitting elements, and the first substrate may include a first region in which pixels of a first column are disposed, a second region in which pixels of a second column are disposed, and a third region disposed between the first region and the second region, the plurality of wiring members may be disposed on the first region and the second region among the front surface of the first substrate.