Display Wiring Pad Structure for Reliable External Connections
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Solution Overview
Problem
Existing display devices face challenges in efficiently connecting external devices to the display panel, particularly in ensuring reliable electrical connections between the circuit wires and the pad electrodes, which can affect the overall performance and reliability of the display.
Innovation Solution
The display device incorporates a wiring pad and a dummy pad on a first substrate, with a planarization layer and electrode base layers connected by conductive balls, allowing for electrical connection through a conductive ink application and alignment under an electric field, followed by a heat treatment to secure the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring pad and dummy pad are disposed on a first substrate with planarization layers and electrode base layers, then the electrical connectivity between external devices and display panel is improved, but the device complexity increases due to multiple layers and components
Solution Approach 1:
The pad electrode is divided into a base layer and an upper layer, with the base layer providing electrical connection through the planarization layer and the upper layer providing connection to external devices. This segmentation allows each layer to perform its specific function optimally, improving electrical connectivity while maintaining manageable complexity through functional division.
Solution Approach 2:
The patent employs a multi-layer nested structure where the pad electrode base layer is embedded within the planarization layer, which itself is part of the substrate structure. The pad electrode upper layer is then positioned on top, creating a nested arrangement that integrates multiple functional layers into a compact configuration, improving connectivity without excessive complexity increase.
2Reliability
If multiple layers including planarization layer, insulating layer, and electrode layers are used, then the reliability of electrical connection is improved, but the manufacturing process complexity increases
Solution Approach 1:
The planarization layer is formed in advance before the pad electrode base layer is created. This preliminary action provides a flat, stable foundation that simplifies subsequent manufacturing steps, ensuring reliable electrical connection while making the overall manufacturing process more manageable by preparing the structure in a logical sequence.
Solution Approach 2:
The insulating layer is selectively positioned to cover specific portions of the pad electrode base layer, providing localized insulation where needed. This local quality approach ensures reliable electrical connection by preventing short circuits in critical areas while minimizing unnecessary materials and processing steps, thereby improving connection reliability without excessive manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the electrical connectivity between the external devices and the display panel, improving the reliability and performance of the display device by ensuring stable and durable connections.
Implementation Method 1
alignment under an electric field
Implementation Method 2
followed by a heat treatment to secure the connection
Data Source
AI summary
A display includes a wiring pad and a dummy pad on a first substrate. A first planarization layer is disposed on the wiring pad and the dummy pad. A first pad electrode layer is connected to the wiring pad and a second pad electrode layer is connected to the dummy pad. The first and second pad electrode layers are disposed on the first planarization layer. A first insulating layer covers the first and second pad electrode layers. A first pad electrode upper layer is disposed on the first pad electrode layer. A second pad electrode upper layer is disposed on the second pad electrode layer. The wiring pad, the first pad electrode layer, and the first pad electrode upper layer are electrically connected. The dummy pad, the second pad electrode layer, and the second pad electrode upper layer are electrically connected.