Multi-Layer Wiring Layout for Display Device Peripheral Regions
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Solution Overview
Problem
The existing display devices face challenges in efficiently arranging a large number of wiring lines in the peripheral regions due to the need for reduced wiring resistance and the integration of lead-out lines, which complicates the layout and increases the area of the peripheral region.
Innovation Solution
The display device incorporates a substrate with a display region and a peripheral region, featuring multiple signal lines, terminals, and wiring lines arranged in specific layers and configurations, including a first metal layer, a second metal layer, and a third metal layer, with insulating films in between, allowing for efficient coupling and reduced resistance values while preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wiring width of drive signal supply wiring is increased to reduce wiring resistance, then the wiring resistance is reduced, but the area of the peripheral region expands and the layout becomes more complex
Solution Approach 1:
The patent transitions from planar wiring arrangement to three-dimensional multi-layer wiring structure. Drive signal supply wiring is routed through different metal layers (first metal layer, second metal layer, third metal layer) stacked vertically, allowing signals to travel in multiple spatial dimensions. This reduces the horizontal area required in the peripheral region while maintaining low resistance through adequate wiring width in each layer.
Solution Approach 2:
The peripheral region is divided into multiple wiring regions (first wiring region, second wiring region, third wiring region) corresponding to different metal layers. Each layer handles specific wiring functions, with drive signal supply wiring segmented across layers to reduce resistance without concentrating all wiring in a single planar region, thus avoiding peripheral area expansion.
2Adaptability or versatility
If a large number of lead-out lines and drive signal supply wiring are arranged in the same peripheral region, then the device integration is improved, but the layout complexity increases and efficient arrangement becomes difficult
Solution Approach 1:
The patent resolves layout complexity by distributing lead-out lines and drive signal supply wiring across multiple vertical layers. The first metal layer, second metal layer, and third metal layer provide distinct routing planes, allowing dense integration of numerous wiring lines without planar congestion. This multi-dimensional arrangement maintains high device integration while simplifying the two-dimensional layout design.
Solution Approach 2:
Multiple metal layers serve universal wiring functions, with each layer capable of carrying both lead-out lines and drive signal supply wiring. This multi-functional wiring structure allows flexible arrangement of numerous signal lines across layers, achieving high integration without increasing the complexity of arranging all lines in a single layer.
Data Source
AI summary
A display device includes a substrate, a plurality of signal lines, a plurality of terminals, a plurality of wiring lines, metal wiring, a second metal layer, a third metal layer. In a first wiring region, each wiring line is composed of the first metal layer and extends in a second direction intersecting with the first direction. In a second wiring region between the first wiring region and the terminals, the wiring lines include the wiring line composed of the first metal layer and the second metal layer and the wiring line composed of the third metal layer. The metal wiring is provided in a different layer from the first metal layer; and intersects with the wiring lines in the first wiring region and extends in the first direction when viewed from a direction perpendicular to the substrate.