Disposable Bond Gap Control Structures for Semiconductor Wafer Bonding
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Solution Overview
Problem
Existing bonding techniques for semiconductor wafers face challenges in achieving uniformity of bond lines due to substrate flatness and bond force variations, and are limited by the materials that can be used for bond gap control structures (BGCS) since they must remain on the substrate.
Innovation Solution
A disposable bond gap control structure (BGCS) is placed outwardly from a substrate, controlling the geometry of the bond line by being formed from various materials that can be removed after bonding, using deposition, bonding, and removal systems to ensure uniformity and expand material choices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a bond gap control structure is used to control bond line geometry, then manufacturing precision is improved, but device complexity increases due to the additional structure and removal process
Solution Approach 1:
The patent employs a disposable bond gap control structure that is intentionally designed to be temporary and removable. This disposable structure provides precise bond line geometry control during the bonding process, then is removed afterward. The principle resolves the contradiction by accepting the temporary complexity of adding and removing the structure in exchange for significant gains in bond line uniformity and manufacturing precision.
2Manufacturing precision
If materials with desirable bonding properties are used for BGCS, then manufacturing precision is improved, but reliability deteriorates if the materials cause problems when left on the substrate
Solution Approach 1:
The patent extracts the bond gap control structure from the final device configuration, designing it to be removed after serving its purpose. This allows the use of materials with excellent bonding and gap control properties during the bonding process, while eliminating any potential negative effects these materials might have on substrate performance if left in place. The extraction principle resolves the contradiction by separating the temporary control function from the permanent device structure.
3Device complexity
If the BGCS remains on the substrate after bonding, then device complexity is reduced, but manufacturing precision is compromised due to material limitations
Solution Approach 1:
The patent employs a disposable bond gap control structure that is intentionally designed to be temporary and removable. This disposable structure provides precise bond line geometry control during the bonding process, then is removed afterward. The principle resolves the contradiction by accepting the temporary complexity of adding and removing the structure in exchange for significant gains in bond line uniformity and manufacturing precision.
Solution Approach 2:
The patent changes the physical or chemical state of the bond gap control structure to enable removal after bonding. By designing the structure and selecting materials that allow for post-bonding removal through various mechanisms (etching, dissolution, mechanical removal), the patent achieves both good manufacturing precision during bonding and acceptable device complexity by enabling the structure's elimination.
Data Source
AI summary
In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.