Distal End Frame Segmentation for Endoscope Diameter Reduction
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Solution Overview
Problem
Conventional endoscopes with distal end frames using molded interconnect devices (MIDs) face challenges in reducing the diameter of the distal end portion while ensuring sufficient insulation and noise resistance, and facilitating easy disassembly and reuse of the image pickup unit.
Innovation Solution
The distal end frame is designed with a resin molded product having a metal pattern, featuring a housing chamber with a recessed portion and a joining member that connects two frame members, allowing for the formation of metal patterns for electrical connections and shielding, reducing the diameter and enhancing insulation and electromagnetic shielding without exposing wiring to the outer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin molded product with metal pattern (MID) is used for the distal end frame, then insulation and noise resistance are improved, but the diameter of the distal end portion cannot be reduced sufficiently
Solution Approach 1:
The distal end frame is divided into multiple sections: a proximal end section with metal pattern for insulation/shielding, and a distal end section without metal pattern for diameter reduction. This segmentation allows each section to optimize for its specific function while collectively solving the contradiction between shielding performance and size reduction.
Solution Approach 2:
The metal pattern is applied locally only to the proximal end section of the distal end frame where insulation and noise resistance are most needed, rather than covering the entire frame. This localized application maintains shielding effectiveness at critical areas while reducing overall material usage and diameter.
2Ease of manufacture
If the distal end frame is made as a single integrated piece, then manufacturing is simplified, but disassembly and reuse of the image pickup unit becomes difficult
Solution Approach 1:
The distal end frame is divided into a proximal end section and a distal end section that can be separated from each other. The image pickup unit is mounted on the distal end section, which can be detached from the proximal end section. This segmentation enables easy disassembly for image pickup unit replacement or upgrade while maintaining manufacturing efficiency through modular assembly.
Solution Approach 2:
The distal end frame transitions from a static integrated structure to a dynamic modular structure where the distal end section can be separated and reattached. This dynamic design allows the frame to adapt between assembled state (for compactness) and disassembled state (for maintenance and reuse).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the diameter of the distal end portion, ensures adequate insulation and noise resistance, and allows for easy disassembly and reuse of the image pickup unit by using a lower melting point solder for joining the frame members.
Implementation Method 1
a joining member configured to join the first distal end frame member and the second distal end frame member to each other
Data Source
AI summary
A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.