Distance Sensor With Hydrocarbon-Ceramic Laminate for Heat Stability
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Solution Overview
Problem
Existing capacitive and inductive sensors face challenges in maintaining reliable measurement characteristics under varying environmental conditions, particularly at elevated temperatures, due to anisotropic thermal expansion and mechanical stress in conventional printed circuit boards, leading to unpredictable measurement quality and potential sensor defects.
Innovation Solution
The use of a hydrocarbon-ceramic laminate as a carrier material, which provides a homogeneous coefficient of thermal expansion and low anisotropy, allowing for flexible and cost-effective sensor configurations with stable electrical and mechanical properties, even under fluctuating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional printed circuit boards (FR4) are used as carrier material, then manufacturing cost and ease of manufacture are improved, but measurement precision and reliability deteriorate at elevated temperatures due to anisotropic thermal expansion
Solution Approach 1:
The patent applies composite materials by using a ceramic-based carrier material that combines the benefits of low thermal expansion with the manufacturability of printed circuit board technology. The ceramic material provides homogeneous thermal expansion properties while maintaining compatibility with conventional sensor element integration methods, thus resolving the contradiction between ease of manufacture and measurement precision at elevated temperatures.
Solution Approach 2:
The patent changes the fundamental parameter of the carrier material from organic resin-based (FR4) to ceramic-based, which fundamentally alters the thermal expansion characteristics. This parameter change enables the carrier to maintain dimensional stability at high temperatures while still allowing for cost-effective manufacturing through established printed circuit board processes.
2Ease of manufacture
If conventional printed circuit boards (FR4) are used as carrier material, then manufacturing cost is improved, but reliability deteriorates at elevated temperatures due to mechanical stress from differential expansion
Solution Approach 1:
The ceramic-based carrier material acts as a composite solution that maintains structural integrity at high temperatures. The material's homogeneous thermal expansion properties prevent differential expansion stresses that would otherwise cause delamination or breakage of sensor elements, thereby improving reliability while maintaining manufacturing cost-effectiveness through conventional PCB-like fabrication processes.
3Ease of manufacture
If conventional printed circuit boards are used, then sensor production is cost-effective, but measurement quality becomes unpredictable at elevated temperatures due to anisotropic expansion
Solution Approach 1:
The patent changes the thermal expansion parameter of the carrier material from anisotropic (different in different directions) to isotropic (uniform in all directions) by using ceramic-based material. This parameter change ensures predictable sensor behavior and measurement quality at elevated temperatures while maintaining cost-effectiveness through manufacturing processes similar to conventional printed circuit board technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable measurement characteristics across a wide range of temperatures, from 0 to 280°C, with minimal mechanical stress and predictable sensor behavior, using methods similar to conventional printed circuit board technology.
Implementation Method 1
the carrier comprises a hydrocarbon-ceramic laminate, is based on a hydrocarbon-ceramic laminate or consists of a hydrocarbon-ceramic laminate... provides a homogeneous coefficient of thermal expansion and low anisotropy
Implementation Method 2
capacitive or inductive or eddy-current effect sensor
Implementation Method 3
capacitive or inductive or eddy-current effect sensor
Implementation Method 4
capacitive or inductive or eddy-current effect sensor
Data Source
AI summary
The aim of the invention is to provide a reliable measuring behaviour in a wide variety of environmental conditions using structurally simple means. This is achieved in that a sensor (1) for measuring a distance or a position, in particular a sensor (1) which operates in a capacitive or inductive manner or on the basis of an eddy current, comprising a support (3) and comprising a sensor element (2) which is arranged on the support (3) or is integrated in the support (3), is configured and developed such that the support (3) has a hydrocarbon-ceramic laminate, is designed on the basis of a hydrocarbon-ceramic laminate or consists of a hydrocarbon-ceramic laminate.