Distributed Envelope Tracking IC Layout for Low-Inductance PA Supply

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Solution Overview

Problem

High modulation bandwidth RF signals in mobile communication devices lead to misalignment of time-variant ET voltages with power envelopes, causing unwanted distortions and reduced linearity in power amplifiers due to trace inductance.

Innovation Solution

A distributed power management apparatus with separate ETICs on opposite sides of a wireless device, generating ET voltages and low-frequency currents to reduce trace inductance and signal distortion, including a control circuit to couple voltage circuits and provide target voltages to distributed ETICs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single centralized ETIC is used to generate ET voltages for all power amplifier circuits, then device complexity is reduced, but trace inductance increases causing signal distortion and misalignment between ET voltages and power envelopes

Engineering Contradiction:
ImproveETIC structure complexityVSAvoidtrace inductance and signal distortion
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the centralized ETIC into multiple distributed ETICs, with each ETIC serving a specific power amplifier circuit. This segmentation reduces the trace inductance between the ETIC and each power amplifier, thereby minimizing signal distortion and maintaining proper alignment between ET voltages and power envelopes, while accepting increased overall device complexity through the distributed architecture.

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If distributed ETICs are used closer to each power amplifier circuit, then trace inductance and signal distortion are reduced, but device complexity increases

Engineering Contradiction:
Improvetrace inductance and signal distortionVSAvoidETIC structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent implements local quality by placing each ETIC in close proximity to its corresponding power amplifier circuit, optimizing the local electrical connection to minimize trace inductance and signal distortion. This localized approach ensures high-quality voltage delivery to each amplifier while managing the overall system complexity through functional distribution.

Inventive Principle:
Principle #3Local quality

3Reliability

If ET voltages are generated to track high modulation bandwidth RF signals (>200 MHz), then linearity is improved, but trace inductance causes misalignment and unwanted distortions

Engineering Contradiction:
Improvepower amplifier linearityVSAvoidtrace inductance effects
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent segments the voltage generation function into multiple distributed ETICs, each located close to its served power amplifier. This segmentation reduces the trace inductance in the voltage delivery path, enabling accurate tracking of high modulation bandwidth RF signals (>200 MHz) without the misalignment and distortion problems that would occur with a centralized ETIC.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240364268A1Distributed power management apparatus
Publication Date: 2024.10.31 QORVO US INC
  • US20240364268A1 patent drawing
  • US20240364268A1 patent drawing
  • US20240364268A1 patent drawing

AI summary

A distributed power management apparatus is provided. The distributed power management apparatus includes an envelope tracking (ET) integrated circuit (ETIC) and a distributed ETIC separated from the ETIC. The ETIC is configured to generate a number of ET voltages for a number of power amplifier circuits and the distributed ETIC is configured to generate a distributed ET voltage(s) for a distributed power amplifier circuit(s). In a non-limiting example, the number of power amplifier circuits and the distributed power amplifier circuit(s) can be disposed on opposite sides (e.g., top and bottom) of a wireless device. As such, in embodiments disclosed herein, the ETIC is provided closer to the power amplifier circuits and the distributed ETIC is provided closer to the distributed power amplifier circuit(s). By providing the ETIC and the distributed ETIC closer to the respective power amplifier circuits, it is possible to reduce trace inductance and unwanted signal distortion.