Distributed Fiber-Optic Packer Sensing for Casing and Formation Deformation
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Solution Overview
Problem
Existing methods for monitoring downhole casing deformation suffer from inaccuracies, lack of real-time visualization, and uncertainty in sensor location, leading to compromised structural integrity due to metal loss and deformation.
Innovation Solution
A wellbore deformation instrument featuring an expandable annular cylindrical packer with embedded fiber-optic coils in a deformable substrate, a tray-shaped receptacle, and an optical coupler, coupled to a fiber-optic cable, which uses laser pulses to detect backscattered signals for real-time deformation monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional deformation monitoring methods (caliper logs, electromagnetic sensors) are used, then structural integrity can be assessed, but measurement accuracy and real-time visualization are compromised
Solution Approach 1:
The patent replaces traditional mechanical caliper systems and electromagnetic sensors with a fiber-optic based sensing system. The fiber-optic cable embedded in the deformable substrate detects deformations through optical measurements rather than mechanical contact or electromagnetic fields, providing higher measurement precision without compromising structural integrity assessment
Solution Approach 2:
The patent introduces a deformable substrate as an intermediary between the wellbore casing and the fiber-optic sensors. This substrate transfers the mechanical deformations of the casing to the fiber-optic cable, enabling accurate measurement while maintaining the structural integrity of the original casing
2Loss of information
If traditional monitoring systems are deployed, then deformation data can be collected, but real-time visualization and location accuracy are lost
Solution Approach 1:
The patent implements continuous real-time monitoring through the fiber-optic cable system that remains continuously connected to the deformable substrate and wellbore casing. The optical measurements are continuously captured and transmitted, eliminating data gaps and enabling immediate visualization of deformation events as they occur
Solution Approach 2:
The patent establishes a feedback loop where deformation measurements are continuously captured by the fiber-optic sensors, processed, and used to generate real-time visualization of wellbore conditions. This feedback mechanism enables immediate detection and response to deformation events, preventing information loss and reducing response time
3Difficulty of detecting and measuring
If electromagnetic sensors are used for deformation monitoring, then general deformation detection is possible, but sensor location accuracy and data reliability deteriorate
Solution Approach 1:
The patent transitions from electromagnetic sensing to optical sensing, representing a dimensional change in the measurement approach. The fiber-optic cable provides precise spatial localization through the distribution of sensing points along its length, enabling accurate determination of deformation locations that electromagnetic sensors cannot achieve
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate, real-time, and multi-point characterization of casing and formation deformations, supporting measurements during downhole tests and stimulation, with varying resolution along azimuthal and height axes.
Implementation Method 1
an optical analyzer, configured to launch a laser pulse into the fiber-optic cable at the wellhead and receive a backscattered laser pulse from each of the at least one fiber-optic coil through the fiber-optic cable
Data Source
AI summary
An apparatus, method, and system for monitoring wellbore deformation is disclosed. The apparatus includes an expandable annular cylindrical packer and a plurality of assemblies mounted on an exterior circumferential surface of the packer. The plurality of assemblies are configured to be pressed against a wellbore surface by the packer. Each of the assemblies includes at least one fiber-optic coil embedded in a sheet of deformable substrate, a tray-shaped receptacle formed from a low thermal conductivity material and attached along the rim to an edge of the sheet with a pressure tight-seal, and an optical coupler configured to couple the fiber-optic coil to a fiber-optic cable. The assemblies further include a pressure-tight compartment containing a high-pressure inert gas that is formed by the receptacle, the sheet, and the seal.


