Distributed Indexing for MEMS Chip Positioning
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Solution Overview
Problem
The increasing size of electronic devices due to lengthy indexing techniques poses challenges in miniaturization, as existing methods require longer indexes that can damage active areas and increase device size, particularly in MEMS devices formed by coupling sensor and cap chips.
Innovation Solution
Distributing the index on both the sensor and cap chips, with a first portion on the sensor chip and a second portion on the cap chip, allowing for reduced size and avoiding damage during writing, while maintaining effective localization without increasing the device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the index is written on the sensor chip only, then the index can be read to identify chip position, but the index length increases causing damage to active areas and increasing device size
Solution Approach 1:
The index is divided into two portions: a first portion written on the sensor chip and a second portion written on the cap chip. This segmentation allows the total index information to be distributed across both chips, reducing the length of index on each individual chip and preventing damage to active areas while maintaining position identification capability.
2Quantity of substance
If the index length is increased to identify more chip positions, then more chips can be tracked, but the device size increases and miniaturization is hindered
Solution Approach 1:
The indexing system transitions from a single-dimension approach (writing entire index on one chip) to a two-dimension approach (writing index portions on two different chips). This dimensional change allows the system to accommodate more indexable chips without increasing the index length on any single chip, thus supporting miniaturization.
3Reliability
If the index is written in regions spaced from active areas, then active areas are protected from damage, but the device size increases
Solution Approach 1:
By segmenting the index across two chips, each chip carries only a portion of the index information. This allows the index portions to be placed in regions closer to active areas without causing damage, as the reduced index length on each chip minimizes the spacing requirement while maintaining protection of active areas.
Data Source
AI summary
A method for indexing electronic devices includes: forming first chips in a first wafer, forming second chips in a second wafer, forming the electronic devices by coupling each first chip with a corresponding second chip, and forming an index on each electronic device. The index is indicative of a position of the corresponding first chip in the first wafer. The step of forming an index includes forming a first portion of the index on the first chip, and forming a second portion of the index on the second chip.