Distributed LDO Layout for SoC Thermal Hot Spot Control
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Solution Overview
Problem
Concentration of integrated voltage regulators on a processor die creates localized hot spots, limiting performance gains and potentially exacerbating thermal issues.
Innovation Solution
Implementing distributed low dropout regulators (LDOs) that can be dynamically controlled based on thermal information, enabling or disabling them to manage thermal hot spots and reduce heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If integrated voltage regulators are concentrated in one place on the die, then inductance locality issues are addressed and power regulation efficiency is improved, but localized hot spots are created and thermal distribution is worsened
Solution Approach 1:
The patent segments the concentrated voltage regulator functionality into multiple distributed LDO units spread across different regions of the processor die. Each LDO serves a local region, segmenting both the power regulation function and the thermal load. This segmentation resolves the contradiction by maintaining regulation efficiency through local induction while distributing heat generation across multiple locations rather than concentrating it in one place.
Solution Approach 2:
The patent implements local quality by placing LDO units in specific regions where they can provide optimized power regulation for nearby circuitry while generating heat locally rather than centrally. Each LDO region has tailored characteristics suitable for its local power and thermal requirements, resolving the contradiction between efficient local regulation and thermal management.
2Use of energy by moving object
If voltage reduction is implemented at the transistor level, then active power savings are achieved through squared voltage reduction, but regulator efficiency is compromised
Solution Approach 1:
The patent implements dynamic control of LDO enable/disable states based on real-time thermal feedback from temperature sensors. The system dynamically adjusts regulator operation to maintain optimal efficiency while responding to changing thermal conditions, resolving the contradiction between power savings and regulator efficiency through adaptive behavior rather than static voltage reduction.
Solution Approach 2:
The patent changes the operational parameters of the LDOs dynamically based on thermal conditions. Instead of fixed voltage reduction, the system adjusts enable/disable states and operational modes according to temperature feedback, allowing the regulator to maintain high efficiency under normal conditions while providing power savings when thermal conditions permit.
3Ease of manufacture
If LDOs are distributed across the die, then layout constraints are eased and thermal hot spots are minimized, but device complexity increases
Solution Approach 1:
The patent implements self-service through automatic thermal management where temperature sensors monitor local conditions and feed back to control logic that automatically enables or disables appropriate LDOs. This self-regulating system reduces the burden on external control mechanisms and simplifies the overall control architecture despite the distributed physical layout, resolving the contradiction between manufacturing ease and control complexity.
Solution Approach 2:
The patent incorporates feedback loops where temperature sensors continuously monitor thermal conditions and provide input to control logic that adjusts LDO operation accordingly. This feedback mechanism automates the management of distributed regulators, reducing the effective complexity by providing intelligent, adaptive control rather than requiring complex external management circuitry.
Data Source
AI summary
In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.