Distributed Memory Bank Interconnects for Low-Latency Data Movement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing processor operations on large data blocks suffer from high latency due to scatter and gather operations involving centralized memory access, which can be inefficient and power-consuming.

Innovation Solution

Implementing a distributed memory architecture where processors are directly coupled to local portions of memory through interconnects, allowing for localized data access and reduced latency via direct communication between memory banks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If centralized memory access is used for processing large data blocks, then data can be stored and retrieved through a single memory controller, but latency increases and processing efficiency decreases

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidlatency
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The memory system is divided into multiple memory banks (first memory bank, second memory bank, etc.), each capable of independent operation. Processors are similarly divided into multiple processing units, with each processor directly coupled to specific memory banks through interconnects. This segmentation allows parallel access to different memory regions, eliminating the bottleneck of centralized memory access and reducing latency for large data block operations.

Inventive Principle:
Principle #1Segmentation

2Use of energy by stationary object

If centralized memory access is used, then memory structure is simplified, but power consumption increases due to longer data transmission paths

Engineering Contradiction:
Improvepower consumptionVSAvoidmemory architecture complexity
Core Design Contradiction:
Use of energy by stationary objectVSDevice complexity

Solution Approach 1:

Each processor is directly coupled to specific memory banks through dedicated interconnects, creating localized data access paths. This local quality principle reduces the average transmission distance for data access, as processors can directly access their locally-coupled memory banks without routing through a centralized controller. The result is reduced power consumption for memory operations while the overall system complexity is managed through modular design.

Inventive Principle:
Principle #3Local quality

3Loss of time

If distributed memory banks are used with direct processor coupling, then localized data access reduces latency, but interconnect complexity increases

Engineering Contradiction:
Improveaccess latencyVSAvoidinterconnect structure complexity
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The interconnect structure is segmented into multiple independent pathways, with each processor having dedicated interconnects to its locally-coupled memory banks. This segmentation of the interconnect structure allows for parallel data transmission paths, reducing contention and latency. While the overall interconnect complexity increases due to the distributed nature of the system, the modular segmented design makes the complexity manageable and scalable.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12498876B2Performing distributed processing using distributed memory
Publication Date: 2025.12.16 INTEL CORP
  • US12498876B2 patent drawing
  • US12498876B2 patent drawing
  • US12498876B2 patent drawing

AI summary

In one embodiment, an apparatus comprises: a plurality of banks to store data; and a plurality of interconnects, each of the plurality of interconnects to couple a pair of the plurality of banks. In response to a data movement command, a first bank of the plurality of banks is to send data directly to a second bank of the plurality of banks via a first interconnect of the plurality of interconnects. Other embodiments are described and claimed.