Distributed Power Delivery to Processing Unit

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Solution Overview

Problem

Existing printed circuit board designs often result in unnecessary power dissipation due to a single power supply delivering multiple phases of power, leading to inefficiencies in power delivery to processing units.

Innovation Solution

A printed circuit board design that couples a processing unit to multiple power channels on both sides, with separate power supplies on each side, allowing for simultaneous current draw and distributing power phases around the processing unit to reduce total resistance and power dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single power supply delivers multiple phases of power to a processing unit, then the power delivery structure is simple, but power dissipation increases due to higher total resistance in the power channels

Engineering Contradiction:
Improvepower delivery structureVSAvoidpower dissipation
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The power delivery system is segmented into multiple independent power supplies (e.g., first power supply and second power supply) positioned on opposite sides of the processing unit. Each power supply connects to the processing unit through separate power channels, dividing the total power delivery path into parallel segments. This segmentation reduces the equivalent resistance of the power channels, thereby reducing power dissipation while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If power channels are positioned on one side of the processing unit, then the layout is compact, but the resistance of power channels increases leading to higher power loss

Engineering Contradiction:
Improvelayout compactnessVSAvoidpower loss
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

The power channel layout transitions from a one-sided (single-dimension) arrangement to a two-sided arrangement around the processing unit. Power supplies are positioned on opposite sides of the processing unit, with power channels extending from both sides to connect to the processing unit. This dimensional change creates parallel current paths, reducing equivalent resistance and power loss while maintaining compact layout.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If multiple power supplies are used on both sides of the processing unit, then power dissipation is reduced, but the device complexity increases

Engineering Contradiction:
Improvepower dissipationVSAvoidpower delivery structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

Multiple power supplies (first power supply and second power supply) are merged into a coordinated power delivery system that operates in parallel. The power supplies work together to deliver current to the processing unit through separate channels, combining their contributions to achieve reduced total resistance and power dissipation while distributing the complexity across multiple standardized components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces power dissipation by up to 75% compared to traditional designs, enhancing the efficiency of power delivery and extending the lifespan of power supplies like batteries.

Implementation Method 1

the power channels naturally dissipate a non-zero amount of power in the form of heat due to the impedance (e.g., resistance, etc.) of the power channels

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 2

the power channels naturally dissipate a non-zero amount of power in the form of heat due to the impedance (e.g., resistance, etc.) of the power channels

Methodology Applied
Scientific EffectJoule Heating: Joule Heating

Data Source

PatentUS9317094B2Distributed power delivery to a processing unit
Publication Date: 2016.04.19 NVIDIA CORP
  • US9317094B2 patent drawing
  • US9317094B2 patent drawing
  • US9317094B2 patent drawing

AI summary

Technology is provided for distributed power delivery to a processing unit on a printed circuit board. In one example, a printed circuit board includes a processing unit coupled to multiple power channels, including first channels on a first side of the processing unit, and second channels on a second side of the processing unit. The printed circuit board further includes a first power supply coupled to the processing unit via the first channels, and a second power supply coupled to the processing unit via the second channels. The processing unit is configured to receive a total current, including currents drawn substantially simultaneously from the first power supply and the second power supply. The total current is about equivalent to a current the processing unit would draw from a single power supply.