Distributed Power Supply Layout for Semiconductor Heat Dissipation
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Solution Overview
Problem
The centralized distribution of power supply modules on silicon-based chips leads to slow heat dissipation, reducing the reliability of the chip's operating performance due to excessive heat accumulation in specific areas.
Innovation Solution
A semiconductor device with a driving circuit on an insulating substrate, where power supply modules are distributed closer to functional modules, and a voltage regulation module with a switch assembly and shunt assembly is used to reduce voltage and current, improving heat dissipation and reliability by minimizing voltage drop losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power supply modules are centrally distributed on the silicon-based chip, then the chip size and cost are controlled, but heat dissipation becomes slow and reliability decreases
Solution Approach 1:
The power supply system is segmented from a single centralized power supply module into multiple distributed power supply modules, with each module serving a specific functional module. This segmentation distributes the heat generation across different locations on the chip, preventing heat accumulation in a single area and improving overall heat dissipation while maintaining reliability.
Solution Approach 2:
Each power supply module is locally positioned adjacent to its corresponding functional module, creating localized power supply units. This local quality approach ensures that power supply and heat generation are distributed according to the actual functional requirements of different chip regions, optimizing both power delivery efficiency and thermal management.
2Loss of energy
If power supply modules are centrally distributed, then chip area is reduced, but voltage drop loss increases due to longer transmission distances
Solution Approach 1:
The centralized power supply structure is segmented into multiple distributed power supply modules positioned throughout the chip. This segmentation reduces the average distance between power supply and functional modules, thereby reducing voltage drop losses associated with long transmission distances while utilizing the chip area more efficiently.
Solution Approach 2:
Power supply modules are strategically positioned adjacent to their corresponding functional modules, creating local power supply units. This local quality approach minimizes the transmission distance for power delivery, reducing voltage drop losses and improving power supply efficiency without requiring excessive chip area.
3Temperature
If power supply modules are distributed closer to functional modules, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The power supply system is segmented into multiple independent modules that can be systematically distributed across the chip. Each module follows a standardized design pattern, which reduces the complexity of individual modules while the overall system benefits from improved heat dissipation through distributed architecture.
Solution Approach 2:
Each power supply module is designed to be locally integrated with its corresponding functional module, creating modular units with standardized interfaces. This approach manages complexity by localizing the design challenges to manageable units while maintaining overall system coherence through consistent module architecture.
Data Source
AI summary
A semiconductor device and an electronic terminal are provided. The semiconductor device and the electronic terminal including an insulating substrate and a driving circuit positioned at least on one side of the insulating substrate. The driving circuit includes a plurality of functional modules and a plurality of power supply modules. Each of power supply modules is disposed close to and electrically connected to a corresponding functional module.