Distributed Sensor Modules for High-Temperature Pressure Acquisition

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Solution Overview

Problem

Existing pressure measurement systems face challenges in achieving high frequency data acquisition under extreme conditions of temperature and vibration, particularly in wind tunnel applications, due to limitations in response rate and complexity in cabling and data retrieval.

Innovation Solution

A pressure acquisition system comprising multiple sensor devices with electronic assemblies that digitally convert and compensate sensor output voltages for temperature and pressure errors, allowing for high accuracy measurements without sacrificing frequency response, with sensors capable of operating at high temperatures and high vibrational modes, and using a central module for data processing and storage of compensation values.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a pressure scanner with multiple pressure sensors in a common housing is used, then the system is compact and requires less cabling, but the response rate is greatly lowered due to long tubes running from the scanner to various points along the wing

Engineering Contradiction:
Improvecabling complexityVSAvoidresponse rate
Core Design Contradiction:
Device complexityVSSpeed

Solution Approach 1:

The patent divides the pressure measurement system into distributed sensor modules, each containing its own signal processing electronics. This segmentation allows each sensor to operate independently with minimal cabling, eliminating the need for long tube runs while maintaining compactness. The sensor modules can be directly mounted on the test article surface.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediary signal processing electronics within each sensor module that locally process the pressure sensor signals. This intermediary processing eliminates the need for long analog signal transmission tubes by converting and processing signals at the source, thereby improving response rate while maintaining system compactness.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Speed

If individual pressure sensors are placed at each measurement point with direct output to central data acquisition system, then high frequency data can be taken, but the measurement becomes much more complicated requiring digital conversion and electrical lines from each sensor

Engineering Contradiction:
Improvefrequency data acquisitionVSAvoidsystem implementation complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent merges the pressure sensor, signal processing electronics, and temperature compensation components into integrated sensor modules. This consolidation reduces the number of separate electrical lines and digital conversion requirements, simplifying system implementation while maintaining high frequency data acquisition capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent creates universal sensor modules that can be used at multiple measurement points with identical architecture. Each module performs multiple functions including pressure sensing, signal processing, temperature compensation, and data output, eliminating the need for different types of components at each location and reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If sensors are used in wind tunnel applications with extreme temperatures and vibrations, then accurate pressure measurements can be taken, but the system becomes more difficult to maintain under severe conditions

Engineering Contradiction:
Improvepressure measurement accuracyVSAvoidsystem maintenance difficulty
Core Design Contradiction:
Measurement precisionVSEase of repair

Solution Approach 1:

The patent employs hermetically sealed sensor modules with protective housing that shields the electronic components from extreme temperatures and vibrations. This protective enclosure maintains measurement precision while making the system more resistant to environmental degradation and easier to maintain.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent incorporates automatic temperature compensation and self-diagnostic features within each sensor module. The temperature compensation is built into the electronics, automatically adjusting for environmental conditions without requiring manual intervention. This self-service capability maintains accuracy under extreme conditions while reducing maintenance requirements.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high accuracy, high-frequency pressure measurements under extreme conditions, allowing for the use of a large number of sensors in a small volume, with simplified implementation and maintenance, and the ability to operate at high temperatures without loss of accuracy.

Implementation Method 1

a plurality of sensor devices, each capable of providing an output voltage indicative of an applied pressure

Methodology Applied
Scientific EffectPiezoelectric Effect: Piezoelectric Effect

Implementation Method 2

each output voltage having a unique error voltage due to undesirable variations with temperature and pressure

Methodology Applied
Scientific EffectThermal Expansion: Thermal Expansion

Data Source

PatentUS8578782B2High temperature, high bandwidth pressure acquisition system
Publication Date: 2013.11.12 KULITE SEMICON PROD INC
  • US8578782B2 patent drawing
  • US8578782B2 patent drawing
  • US8578782B2 patent drawing

AI summary

A system for measuring a multiplicity of pressures as those experienced by a model in a wind tunnel is depicted. The system includes individual sensor devices which are connected to an electronics module. The sensors may be connected to the electronics module via a cable in a first embodiment. In an alternate embodiment, the sensors may be connected to the electronics module via a mating connector located therebetween. A memory component which stores compensation coefficients associated with each of the sensors may also be included in the system to correct errors associated with each sensor. The advantage of the various embodiments is that each sensor does not have any compensation stored thereon and thus, the sensors can be made very small to operate at very high temperatures without any loss of accuracy.