Distributed Switch Architecture Scalability
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Solution Overview
Problem
Frame switches are limited in achieving a maximum connection scale due to constraints in the number of slots, structure, and volume, leading to high design and manufacture costs and inefficient heat dissipation and power supply systems.
Innovation Solution
Packaging switching network chip and forwarding chip components as independent devices connected via network cables, with each component including a cartridge housing, heat dissipation, and power supply, forming a distributed switch architecture that eliminates the need for a frame and backplane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If frame switch architecture with slots and backplane is used, then integration and centralized control are achieved, but the connection scale is limited by the number of slots and frame volume
Solution Approach 1:
The patent divides the traditional frame switch into independent distributed switching units. Each unit contains a switching network chip, forwarding chip, heat dissipation component, and power supply component packaged together. These units are connected via network cables instead of being mounted in a centralized frame, enabling scalable expansion without volume constraints.
Solution Approach 2:
The patent transitions from a two-dimensional slot-based frame architecture to a distributed network topology where switching units can be deployed across multiple physical locations. This dimensional shift allows the system to scale beyond the physical constraints of a single frame structure.
2Adaptability or versatility
If more switching network chips and forwarding chips are connected via buses in a frame, then connection scale increases, but design and manufacture costs increase due to frame complexity
Solution Approach 1:
The patent segments the switch functionality into independent packaged units, each containing necessary components (switching network chip, forwarding chip, heat dissipation, power supply). This modular approach simplifies manufacturing by allowing standardized production of individual units that can be deployed independently, reducing the complexity and cost associated with designing and manufacturing large-scale integrated frames.
3Device complexity
If centralized frame architecture is used, then structure is simplified, but heat dissipation and power supply systems become inefficient at large scales
Solution Approach 1:
The patent assigns dedicated heat dissipation components and power supply components to each switching unit, creating localized support systems. This segmentation eliminates the need for a centralized heat dissipation and power distribution system, improving efficiency by reducing energy loss in transmission and enabling independent thermal management for each unit.
Solution Approach 2:
The patent implements local heat dissipation and power supply within each switching unit rather than relying on centralized systems. Each unit has its own heat dissipation component positioned adjacent to the chips it serves, ensuring efficient localized thermal management and reducing energy loss associated with centralized distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a large number of components to be accommodated without size limitations, achieving a maximum connection scale while reducing manufacturing costs and improving heat dissipation and power efficiency.
Implementation Method 1
a first heat dissipation component, configured to dissipate heat for the switching network chip
Implementation Method 2
a first power supply component, configured to supply power to the switching network chip
Data Source
AI summary
Disclosed are a switch, a switching system, a switching network chip component, and a forwarding chip component. The switch includes: a switching network chip component packaged as an independent device, a forwarding chip component packaged as an independent device, and a controller. The switching system includes at least one switch and at least two network devices connected to the switch. The switching network chip component includes: a first cartridge housing, a switching network chip, a first heat dissipation component, and a first power supply component arranged inside the first cartridge housing. The forwarding chip component includes: a second cartridge housing, a forwarding chip, a second heat dissipation component, and a second power supply component arranged inside the second cartridge housing.