Distributed Test System Resources for Equal Signal Path Lengths
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Solution Overview
Problem
Existing test systems face challenges in ensuring equal access to resources for devices under test (DUTs), leading to inconsistencies in signal transmission due to impedance mismatch, unequal electrical path lengths, and signal degradation, which can cause testing discrepancies.
Innovation Solution
A test system with a device interface board (DIB) that distributes resources across its edges, ensuring equal electrical path lengths and impedances for all test instruments, along with an interconnect that processes signals to maintain consistent signal quality and translate contact pitches, allowing for parallel testing of identical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If resources are distributed to enable equal access for devices in sites, then measurement precision is improved, but device complexity increases due to routing connections and signal processing circuitry
Solution Approach 1:
The DIB is segmented into multiple sites distributed across its surface, with each site capable of holding a DUT. Resources are segmented and distributed to multiple sites to enable parallel testing. The interconnect is segmented into multiple routing connections that can be independently configured and processed.
Solution Approach 2:
The interconnect acts as an intermediary between the test instruments and the DIB sites. Signal processing circuitry in the interconnect mediates the signal transmission, combining and routing signals to maintain equal electrical path lengths and impedances across all sites.
2Reliability
If electrical path lengths are made equal for all sites, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The electrical path length parameter is actively controlled and adjusted for each routing connection. Signal processing circuitry modifies signal parameters (such as delay compensation) to ensure that despite physical variations in trace lengths, the effective electrical path lengths remain equal across all sites.
3Productivity
If multiple test instruments access shared resources through routing connections, then productivity is improved, but signal degradation increases
Solution Approach 1:
The interconnect with signal processing circuitry serves as an intermediary that manages signal transmission between multiple test instruments and shared resources on the DIB. The circuitry actively compensates for signal degradation by adjusting signal parameters to maintain consistent quality across all routing connections.
Solution Approach 2:
Signal parameters such as amplitude, frequency, and impedance are dynamically adjusted and optimized for each routing connection. The signal processing circuitry changes these parameters to compensate for degradation effects, ensuring consistent signal quality even as multiple instruments access shared resources in parallel.
Data Source
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AI summary
An example test system has resources that are distributed for access by a device under test (DUT). The example test system includes a device interface board (DIB) having sites to connect to devices to test, and a tester having slots configured to hold test instruments. Each test instrument has resources that are distributed over a dimension of the DIB. The resources are distributed to enable the devices in the sites equal access to the resources.