Distributed Thermoelectric String for Heat Backflow Reduction
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Solution Overview
Problem
Conventional thermoelectric modules face challenges with high density configurations leading to heat backflow, material limitations, and inefficiencies in cooling and heating applications, particularly in personal comfort settings, due to rigid connections and high temperature requirements.
Innovation Solution
A distributed thermoelectric implementation using a string of thermoelectric elements connected by stranded wire conductors woven into panels, allowing for flexible and efficient heat dissipation and absorption without the need for vacuum enclosures or bulky heat sinks, enabling local heating and cooling while generating electricity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermoelectric elements are densely packed to increase cooling capacity, then cooling performance is improved, but heat backflow through air conduction increases and performance is limited
Solution Approach 1:
The patent introduces an insulating panel as an intermediary barrier between the hot and cold sides of thermoelectric elements. This panel physically blocks and thermally insulates against heat backflow through air conduction, allowing elements to be spaced further apart while maintaining cooling performance. The insulating panel acts as a mediator that prevents direct thermal coupling between hot and cold sides.
Solution Approach 2:
The patent segments the thermal path by introducing the insulating panel as a separate component between the hot and cold sides. This segmentation allows independent optimization of each side's thermal management and enables better heat flow control without requiring dense element packing.
2Loss of energy
If thermoelectric elements are spaced out laterally to reduce density, then heat backflow is reduced, but the rigid connection over large distances causes rupture due to thermal expansion stress
Solution Approach 1:
The patent replaces rigid circuit boards with flexible thin films as the connection medium for thermoelectric elements. These flexible films can accommodate thermal expansion and contraction stresses that occur when elements are spaced apart, preventing rupture while maintaining electrical and thermal connections. The flexibility allows the structure to adapt to thermal stress without breaking.
3Ease of manufacture
If traditional high-temperature materials are used to withstand solder reflow oven temperatures, then assembly is possible, but soft materials desired for personal comfort applications cannot be used
Solution Approach 1:
The patent performs preliminary assembly of thermoelectric elements onto the insulating panel before exposing to high temperatures. This allows the use of soft, flexible materials that would otherwise be damaged by solder reflow temperatures, as the critical assembly steps are completed before thermal exposure. The preliminary assembly enables material selection flexibility while maintaining manufacturing capability.
4Loss of energy
If large and heavy heat sinks are used to dissipate heat from the hot side, then heat dissipation is improved, but the temperature gradient through the heat sink subtracts from overall cooling capacity
Solution Approach 1:
The patent extracts and removes the traditional large heat sink component from the system. Instead of using a bulky heat sink that creates temperature gradients, the design relies on the insulating panel to block heat backflow and allows heat to be managed more efficiently at the source. This extraction eliminates the parasitic temperature drop through the heat sink while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces heat backflow, enhances cooling efficiency, and allows for lightweight, flexible, and cost-effective thermoelectric panels that can be integrated into various applications, including personal comfort items and renewable energy systems, achieving performance comparable to vapor compression systems.
Implementation Method 1
The reasons for these dense prior art configurations are well-founded: small elements with low resistance allow larger current I to flow before the resistive heat (12R) generated destroys the thermoelectric cooling (pl1 where p = Peltier coefficient)
Implementation Method 2
Distributed thermoelectric implementation using a string of thermoelectric elements connected by stranded wire conductors woven into panels, allowing for flexible and efficient heat dissipation and absorption without the need for vacuum enclosures or bulky heat sinks, enabling local heating and cooling while generating electricity
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3d
AI summary
Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric "string" is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel. On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.