Distributed Weighting Network for Monolithic Wideband QAM Modulators

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Solution Overview

Problem

Existing high-order quadrature amplitude modulation (QAM) modulators for microwave carrier frequencies are typically assembled from multiple monolithic microwave integrated circuits (MMICs), requiring large size, significant alignment, and tuning, which is inefficient for high-speed and high-order modulation formats.

Innovation Solution

A distributed weighting network that allows for the fabrication of high-speed, high-order QAM modulators on a single monolithic chip, using a summing/splitting network with arbitrary weighting factors over large bandwidths, leveraging modern lithography techniques and identical resistors to achieve well-controlled weighting and simplified signal routing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high-order QAM modulators are assembled from multiple MMICs, then modulation order and data throughput can be achieved, but device size, alignment complexity, and tuning requirements increase significantly

Engineering Contradiction:
Improvedata throughputVSAvoidalignment complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent combines multiple MMIC modules into a single monolithic chip structure, integrating multiple modulator functions that were previously distributed across separate devices. This merging eliminates the need for external alignment and inter-module tuning while maintaining high data throughput capability through integrated signal paths

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The monolithic chip design implements a universal platform that can support multiple modulation formats and data rates through reconfigurable circuitry. The device integrates I/Q modulators, mixers, and filtering functions in a single chip that can be programmed or configured for different communication standards, reducing the need for multiple specialized devices

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Speed

If multiple MMICs are used to achieve high-speed modulation, then modulation rate can be increased, but the number of components and assembly steps increase

Engineering Contradiction:
Improvemodulation rateVSAvoidassembly simplicity
Core Design Contradiction:
SpeedVSEase of manufacture

Solution Approach 1:

The patent integrates multiple high-speed modulator circuits, mixers, and signal processing functions into a single monolithic chip using standard semiconductor fabrication processes. This consolidation maintains the high modulation rates achieved with discrete MMICs while eliminating the complex assembly, packaging, and interconnection requirements of multiple separate devices

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces mechanical assembly and physical alignment of multiple MMICs with integrated circuit fabrication techniques. Electrical connections that would require precise mechanical positioning are instead created through standard semiconductor interconnect layers, eliminating the need for manual alignment and reducing assembly complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Weight of stationary object

If distributed weighting networks are implemented on a single chip, then device size and weight are reduced, but signal routing complexity increases

Engineering Contradiction:
Improvedevice weightVSAvoidsignal routing complexity
Core Design Contradiction:
Weight of stationary objectVSDevice complexity

Solution Approach 1:

The patent implements distributed weighting networks using planar transmission line structures and microstrip geometries that utilize the two-dimensional surface of the chip. Signal routing is achieved through controlled impedance traces that provide weight scaling through geometric dimensions rather than through complex three-dimensional interconnect structures, simplifying the routing architecture

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20120127010A1High-order wide band modulators and multiplying digital-to-analog converters using distributed weighting networks
Publication Date: 2012.05.24 NORTHROP GRUMMAN SYSTEMS CORP
  • US20120127010A1 patent drawing
  • US20120127010A1 patent drawing
  • US20120127010A1 patent drawing

AI summary

A distributed weighting network that employs a summing line including distributed summing blocks disposed thereon. Each summing block includes a plurality of resistors that define a resistor divider network. Each summing block includes at least three ports having an input port, an output port and at least one signal port. A signal applied to each signal port of the summing blocks is modified in amplitude by the resistor divider network and summed with the signal propagating along the summing line being input to the input port and output from the output port of each summing block to provide a combined signal. The distributed weighting network can be part of a digital-to-analog converter or a QAM modulator.