Multi-Stage Distributing Board Heat Exhaust and Dustproof System

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Solution Overview

Problem

Conventional multi-stage distributing boards face challenges in achieving effective heat emission while maintaining waterproof and dustproof functions, with existing designs either hindering heat escape due to closed flaps or compromising on dust and water protection when flaps are opened for heat emission.

Innovation Solution

A heat exhaust and dustproof system with multiple compartments and flaps, featuring heat discharge holes and cover parts that allow for efficient heat emission while minimizing foreign matter and water penetration, including a heat discharge compartment between stages with openings on both sides and strategically placed outlets on panels to facilitate both normal heat dissipation and rapid arc discharge during events.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If flaps are closed to maintain waterproof and dustproof functions, then protection from foreign substances is improved, but heat emission is hindered causing increased internal temperature

Engineering Contradiction:
Improveprotection from foreign substancesVSAvoidinternal temperature
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The flap is segmented into multiple parts: a main flap body and a separate cover part. The cover part can be opened independently to reveal heat discharge holes, while the main flap body remains closed to maintain waterproof and dustproof protection. This segmentation allows simultaneous achievement of both protection and heat emission functions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cover part acts as an intermediary element between the closed flap and the heat discharge holes. It provides a mechanism to selectively expose the heat discharge holes only when needed, without compromising the overall sealed structure of the flap. This intermediary structure enables controlled heat emission while maintaining protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If flaps are opened to enable heat emission, then heat discharge is improved, but waterproof and dustproof functions are compromised

Engineering Contradiction:
Improveheat dischargeVSAvoidwaterproof and dustproof functions
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The flap structure is divided into a main body that remains closed and a cover part that opens for heat emission. This segmentation allows the heat discharge function to be separated from the protection function, enabling heat emission without compromising waterproof and dustproof integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Only a local portion of the flap (the cover part covering heat discharge holes) is made movable for heat emission, while the rest of the flap structure remains fixed and sealed. This local quality change allows heat discharge without affecting the overall protection capability of the flap.

Inventive Principle:
Principle #3Local quality

3Temperature

If multiple heat discharge paths are created, then heat emission efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveheat emission efficiencyVSAvoidflap structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cover part serves multiple functions: it protects the heat discharge holes when closed, and reveals them when opened for heat emission. This multi-functionality reduces the need for separate components for protection and heat discharge, thereby managing complexity while improving heat emission efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system ensures effective heat discharge and maintains waterproof and dustproof integrity, meeting temperature and arc discharge specifications while preventing foreign substance intrusion, thus enhancing the operational stability and safety of the distributing board.

Implementation Method 1

When arcs are caused by short circuits, ground faults, or insulation failures inside such distributing boards, high temperature and high pressure arc gases are generated inside the distributing board. The distributing board has to be capable of rapidly discharging high-temperature, high-pressure arc gas generated by such accidents to the outside

Methodology Applied
Scientific EffectPressure gradient: Pressure Gradient

Implementation Method 2

Arc gases generated from inside the distributing board are discharged to the outside through the outlet or door on the distributing board

Methodology Applied
Scientific EffectThermal convection: Convection

Implementation Method 3

The flap 7 is rotatably installed and opened by its pressure in the event of an arc, allowing the arc to be discharged to the outside

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10923890B2Heat exhaust and dustproof system of multi-stage distributing board
Publication Date: 2021.02.16 LSIS CO LTD
  • US10923890B2 patent drawing
  • US10923890B2 patent drawing
  • US10923890B2 patent drawing

AI summary

A heat exhaust and dustproof system of a multi-stage distributing board according to an embodiment of the present disclosure includes: multiple compartments provided at a cabinet of a distributing board; and multiple flaps provided at each of the multiple compartments, wherein the flaps are provided with multiple outlets for heat emission.