Semiconductor Distribution Layer with Segmented Wire Frame
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Solution Overview
Problem
Conventional distribution layers in semiconductor manufacturing have poor structural and mechanical strength, leading to bond pad damage during wire bonding due to peeling off along with the dielectric layer.
Innovation Solution
A distribution layer structure with a dielectric layer and an embedded wire layer featuring a frame with openings, where the connection line divides the frame into segments, enhancing binding force and mechanical strength without increasing resistance, and including a through via for electrical connection to the bond pad metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional distribution layer structure is used, then the manufacturing process is simple, but the mechanical strength is poor and bond pads may peel off during wire bonding
Solution Approach 1:
The wire layer is segmented into multiple sections by openings, creating a frame structure with connection lines that divide the interior into multiple areas. Each segment remains electrically connected while providing structural reinforcement to prevent peeling during wire bonding processes.
Solution Approach 2:
The distribution layer combines dielectric material with a composite wire layer structure consisting of frame elements and connection lines. This composite structure integrates mechanical strength enhancement with electrical connectivity, creating a multi-functional layer that resists peeling forces.
2Strength
If the wire layer is made solid without openings, then the electrical conductivity is good, but the mechanical strength and binding force are poor
Solution Approach 1:
The wire layer is divided into segments by openings while maintaining electrical connectivity through connection lines. This segmentation allows the structure to gain mechanical strength from the frame configuration while preserving electrical conductivity through the connected segments.
Solution Approach 2:
The wire layer transitions from a two-dimensional solid plane to a three-dimensional frame structure with openings. This dimensional change allows light or other signals to pass through while maintaining electrical connectivity, enhancing mechanical strength without sacrificing conductivity.
3Strength
If openings are added to the wire layer, then the mechanical strength is improved, but the resistance may increase
Solution Approach 1:
The connection lines are strategically positioned to maintain electrical pathways in critical areas while allowing openings in non-critical regions. This local optimization ensures that resistance remains low where current flows while mechanical strength is enhanced where openings provide structural support.
Solution Approach 2:
The wire layer structure serves multiple functions simultaneously: the frame provides mechanical strength, the openings reduce material usage and allow signal passage, and the connection lines maintain electrical connectivity. This multi-functionality resolves the trade-off between strength and resistance.
Data Source
AI summary
A distribution layer structure and a manufacturing method thereof, and a bond pad structure are provided. The distribution layer structure includes a dielectric layer and a wire layer embedded in the dielectric layer. The wire layer includes a frame and a connection line, the frame has at least two openings and is divided into a plurality of segments by the at least two openings. The connection line is located in the frame and has a plurality of connecting ends connected to the frame. The connection line divides an interior of the frame into a plurality of areas, with each segment connected to one of the connecting ends, and each area connected to one of the openings. This structure provides improved binding force between the wire layer and the dielectric layer without increasing a resistance of a wire connecting with a top bond pad.