Diversion Case Fan Layout for Cooling Dense Expansion Components
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Solution Overview
Problem
The increasing number of electronic components in electronic devices leads to space configuration and heat dissipation challenges, necessitating a solution that enhances component density while effectively managing heat.
Innovation Solution
An expansion component with a case, partition, and heat dissipation module, featuring a flow guide case and fan, which divides the space into compartments and utilizes airflow to dissipate heat efficiently across multiple components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of components is increased to provide more interfaces and functions, then the functionality and adaptability are improved, but the maintenance difficulty and failure risk increase
Solution Approach 1:
The patent applies universality by designing a universal connection structure where the expansion component can connect to different bus bars (positive and negative) using the same connection mechanism. The connection structure includes a movable connection部 that can adapt to different terminal types, allowing one expansion component to serve multiple functions and connect to various power distribution interfaces without requiring separate dedicated connections for each terminal type.
2Adaptability or versatility
If the connection structure is made more flexible to accommodate different bus bar positions, then the adaptability is improved, but the manufacturing precision and assembly difficulty worsen
Solution Approach 1:
The patent applies dynamics by incorporating a movable connection部 that can shift position along the expansion component. This movable connection structure allows the connection point to be adjusted dynamically to match different bus bar positions while maintaining precise electrical contact. The movability is constrained within specific ranges to ensure manufacturing precision is maintained while providing sufficient adaptability for different bus bar locations.
3Adaptability or versatility
If the expansion component size is increased to provide more interfaces, then the functionality is improved, but the internal heat generation increases
Solution Approach 1:
The patent introduces thermal management components as intermediaries between the expansion component and the environment. Specifically, heat dissipation fins are attached to the expansion component to increase surface area for heat dissipation, and thermal conduction components are used to transfer heat away from critical areas. These intermediary thermal management elements enable the expansion component to maintain higher interface quantities without excessive temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for increased component density and diversified functionality by optimizing space utilization and heat dissipation, ensuring smooth operation and integration of electronic components.
Implementation Method 1
a fan (31), wherein the fan (31) is accommodated in the connecting section (333)
Data Source
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AI summary
A heat dissipation module (30) includes a diversion case (33) and a fan (31). The diversion case (33) includes an input section (331), an output section (332), and a connecting section (333) that connects the input section (331) and the output section (332), where an angle is defined between an extending direction of the input section (331) and an extending direction of the output section (332), and an end of the input section (331) away from the connecting section (333) and an end of the output section (332) away from the connecting section (333) are respectively inclined relative to the connecting section (333). The fan (31) is accommodated in the connecting section (333). An electronic device assembly includes an expansion component (E1) and the heat dissipation module (30).