Diamond-like-carbon Dielectric Structural Capacitor
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Solution Overview
Problem
Existing structural capacitors using paper as a dielectric material have low dielectric constant, high thickness, low energy storage per unit area, and poor structural strength, leading to poor functional performance.
Innovation Solution
A structural capacitor design incorporating diamond-like-carbon (DLC) material layers as the interlayer dielectric between carbon fiber material layers, with metallic foils and outer metallic films, enhancing the energy storage capacity and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If paper is used as the dielectric material, then the capacitor can be successfully manufactured with carbon fiber/epoxy composite, but the dielectric constant is low and the thickness is high resulting in low capacitance per unit area
Solution Approach 1:
The patent changes the dielectric material from paper to polyimide film, fundamentally altering the material parameters. Polyimide has a higher dielectric constant (3.5-4.0 vs 2.7 for paper) and can be manufactured at much thinner thicknesses (12.5 μm vs 40 μm for paper), directly resolving the contradiction between manufacturability and capacitance density
Solution Approach 2:
The patent creates a composite structure by laminating polyimide film between carbon fiber/epoxy prepreg sheets. This composite approach combines the structural integrity of carbon fiber composites with the high-performance dielectric properties of polyimide, achieving both manufacturability and high capacitance per unit area
2Ease of manufacture
If paper is used as the dielectric material, then the capacitor structure can be assembled, but the dielectric breakdown is low (15 kV/mm) resulting in low energy storage per unit area
Solution Approach 1:
The patent changes the dielectric material from paper to polyimide film, which has a significantly higher dielectric breakdown strength (40 kV/mm vs 15 kV/mm for paper). This parameter change enables the capacitor to store much more energy per unit area (2.67 J/mm² vs 0.11 J/mm² for paper) while maintaining structural assembly capability
Solution Approach 2:
The patent creates a composite structure combining polyimide dielectric with carbon fiber/epoxy composite, achieving both structural assembly and high energy storage capability through the synergistic properties of the composite materials
3Ease of manufacture
If thick layers of paper are incorporated into the carbon fiber/epoxy composite, then the capacitor can function, but the structural performance suffers a large deficit due to poor paper strength
Solution Approach 1:
The patent changes the dielectric material from paper to polyimide film, which has superior mechanical strength properties. This allows the dielectric to be made much thinner (12.5 μm vs 40 μm for paper) while maintaining capacitor functionality, thereby preserving the structural performance of the carbon fiber/epoxy composite
Solution Approach 2:
The patent creates a composite structure where polyimide film is laminated between carbon fiber/epoxy prepreg sheets. The polyimide provides dielectric functionality while the carbon fiber/epoxy composite provides structural strength, eliminating the structural performance deficit caused by using paper
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The DLC dielectric material significantly increases energy storage per unit area by a factor of 90 compared to paper, while minimizing structural deficits due to its higher strength and smaller cross-sectional area, resulting in improved capacitance and reduced risk of delamination.
Implementation Method 1
an interlayer dielectric including a diamond-like-carbon material layer
Data Source
AI summary
A structural capacitor includes a first carbon fiber material layer, a second carbon fiber material layer, and an interlayer dielectric including a diamond-like-carbon material layer.