DLC Electronic Coatings for Miniaturized Passive and Active Components

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Solution Overview

Problem

Existing electronic components, particularly those made from silicon, face limitations in miniaturization and efficiency due to the larger atomic size of silicon compared to carbon, and require improved insulation and tribological properties to enhance performance in various applications.

Innovation Solution

The use of diamond-like carbon (DLC) coatings, which can act as both semiconductor and insulator depending on thickness and sp2/sp3 carbon ratio, is applied in multiple layers to create smaller, more efficient passive and active electronic components, including transistors, diodes, capacitors, and transducers, utilizing deposition methods like CVD and PECVD to achieve desired properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If silicon is used to construct electronic components, then the components can achieve standard semiconductor performance, but the components cannot be made smaller and lack improved tribological properties

Engineering Contradiction:
Improvecomponent sizeVSAvoiddurability and tribological properties
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent changes the material parameter from silicon to diamond-like carbon (DLC), which has a smaller atomic radius. This allows components to be miniaturized while maintaining or improving performance. The DLC material also provides superior tribological properties and durability compared to silicon, resolving the contradiction between size reduction and reliability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs diamond-like carbon as a composite material that combines the benefits of diamond hardness and carbon flexibility. This composite material enables both miniaturization and enhanced durability/tribological properties, simultaneously addressing both requirements that were in contradiction when using pure silicon.

Inventive Principle:
Principle #40Composite materials

2Reliability

If typical insulating materials are used in electronic components, then electrical insulation is achieved, but the components are larger and less efficient

Engineering Contradiction:
Improveelectrical insulation performanceVSAvoidcomponent size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent changes the insulating material from traditional options to diamond-like carbon with specific sp3 bonding characteristics. This material provides excellent electrical insulation performance while having a smaller atomic footprint, allowing for miniaturized components without sacrificing insulation quality.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces traditional mechanical/physical insulation structures with DLC coatings that provide insulation through their inherent material properties at the nanoscale. This substitution enables thinner insulating layers that maintain performance while reducing overall component size.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If DLC coatings are used to reduce component size, then miniaturization is achieved, but manufacturing complexity increases

Engineering Contradiction:
Improvecomponent sizeVSAvoidmanufacturing process complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent uses diamond-like carbon to serve multiple functions simultaneously: as the structural material for miniaturization, as the insulating layer, and as the semiconducting material when doped. This multi-functionality reduces the number of separate manufacturing steps and materials needed, thereby reducing overall manufacturing complexity despite the advanced material science involved.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent employs DLC as a composite material system that can be tuned through doping and processing to achieve different properties. This versatility allows a single material platform to replace multiple different materials and processes, simplifying the manufacturing workflow while enabling miniaturization.

Inventive Principle:
Principle #40Composite materials

4Productivity

If DLC is used as both insulator and semiconductor, then component efficiency improves, but material property control becomes more difficult

Engineering Contradiction:
Improvecomponent efficiencyVSAvoidmaterial property control
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent controls the sp2/sp3 ratio parameter of diamond-like carbon to switch between insulating and semiconducting behavior. By adjusting this fundamental material parameter through doping concentration and deposition conditions, the same DLC material can be optimized for different functional requirements, improving component efficiency while providing a systematic approach to property control.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

DLC coatings enable the creation of smaller, more efficient electronic components with improved insulation and tribological properties, allowing for enhanced performance in applications such as miniaturization, increased power storage, and reduced friction, while maintaining control over electrical properties.

Implementation Method 1

the DLC layer provides electrical insulation between the source terminal and the drain terminal

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

the gate terminal is disposed onto the DLC layer such that the gate terminal is insulated from the body

Methodology Applied
Scientific EffectElectrostatic insulation: Electrostatic Induction

Implementation Method 3

A first embodiment is directed to a transistor comprising a body region... a diamond-like carbon layer (DLC) disposed between the source terminal and the drain terminal

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 4

at least one additional layer comprising DLC deposited onto the at least one layer of the electronic component material

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS20240258400A1Diamond-like carbon coating for passive and active electronics
Publication Date: 2024.08.01 HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES LLC
  • US20240258400A1 patent drawing
  • US20240258400A1 patent drawing
  • US20240258400A1 patent drawing

AI summary

Systems and methods for building passive and active electronics with diamond-like carbon (DLC) coatings are provided herein. DLC may be layered upon substrates to form various components of electronic devices. Passive components such as resistors, capacitors, and inductors may be built using DLC as a dielectric or as an insulating layer. Active components such as diodes and transistors may be built with the DLC acting substantially like a semiconductor. The amount of sp2and sp3 bonded carbon atoms may be varied to modify the properties of the DLC for various electronic components.