DLC-Coated Silicon Carbide Wafer Chuck for Dusting and Wear
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Solution Overview
Problem
Silicon carbide ceramic wafer chucks experience dusting issues due to microcracks and surface wear, leading to circuit failures and reduced positioning accuracy, with existing solutions like polycrystalline diamond or hard carbon films only addressing surface dusting while compromising mechanical strength and flatness.
Innovation Solution
A ceramic wafer chuck with an oxidation-treated layer and a diamond-like carbon (DLC) film on its surface, formed through specific temperature and time-controlled oxidation treatment and subsequent DLC film deposition, enhances durability and adhesion while reducing dusting on all surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a polycrystalline diamond film or hard carbon film is formed on the wafer chuck surface, then dusting is reduced on the surface, but dusting cannot be reduced on side surfaces or back surfaces where the film is not formed
Solution Approach 1:
The patent applies a diamond-like carbon film coating to all surfaces of the silicon carbide wafer chuck including the front surface, side surfaces, and back surface. This universal coating approach ensures that dusting is reduced on all surfaces, not just the front surface, making the solution versatile and comprehensive in addressing the dusting problem across the entire chuck structure.
2Object-generated harmful factors
If heat treatment is performed in air or oxidizing atmosphere to reduce dusting, then a surface oxide film is formed, but mechanical strength decreases and friction coefficient increases
Solution Approach 1:
The patent changes the material parameter from oxide film to diamond-like carbon film. Instead of relying on heat treatment to form an oxide film that reduces dusting but weakens the material, the invention uses diamond-like carbon film coating which provides dusting reduction while maintaining or improving mechanical strength and reducing friction coefficient, thus resolving the contradiction through parameter change.
Solution Approach 2:
The patent creates a composite structure by coating diamond-like carbon film on the silicon carbide wafer chuck surface. This composite material approach combines the benefits of both materials: the silicon carbide substrate provides structural strength while the diamond-like carbon coating provides dusting reduction, maintaining mechanical strength while achieving the desired surface properties.
3Duration of action of stationary object
If sliding occurs on wafer members for extended periods, then wear occurs, but positioning accuracy and exposure performance deteriorate
Solution Approach 1:
The patent changes the surface material parameter from bare silicon carbide to diamond-like carbon film. This parameter change significantly reduces the friction coefficient and wear rate, allowing the wafer chuck to maintain its positioning accuracy and flatness over extended periods of sliding contact, thus extending service life without compromising manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces dusting and improves durability by forming a robust DLC film on the entire surface, including pin portions, maintaining high mechanical strength and thermal conductivity, thus preventing circuit failures and maintaining positioning accuracy.
Implementation Method 1
heat treatment at a temperature in the range of 400° C. to 1400° C. in the air or in an oxidizing atmosphere can reduce dusting. This is because heat treatment in the air or in an oxidizing atmosphere forms a surface film containing an oxide.
Implementation Method 2
forming a film made of diamond-like carbon (DLC) on its outermost surface
Data Source
AI summary
A wafer chuck includes a base made of a ceramic containing silicon carbide. The base has an oxidation-treated layer, and a film made of diamond-like carbon (DLC) is formed on an outermost surface of the base.