DMD Assembly Elastic Protrusion Fixing Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional DMD chip and driver board connections are prone to displacement and separation due to external factors, leading to inaccurate and unsteady contact, which results in quality issues with projected images, and require high precision in structural parts' sizes and installation, making assembly and dismantlement inconvenient.
Innovation Solution
A DMD assembly design featuring a chip substrate mounted in a base with an elastic protrusion and a fixing frame that includes an insertion hole and conductive spring leaves for precise and stable contact, along with a locating structure to ensure accurate alignment and secure attachment of the driver board, using elastic materials to prevent damage to ceramic parts and ensure stable contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws are used to screw the driver board to press against contacts on the DMD chip, then the connection is achieved, but the connection is prone to displacement and separation due to external factors
Solution Approach 1:
The connection structure is segmented into modular components: a fixing frame with insertion holes, a base with mounting grooves, and elastic protrusions with pressing portions. This segmentation allows each component to perform its specific function independently while contributing to the overall stable connection.
Solution Approach 2:
The elastic protrusion introduces dynamic elasticity to the connection system. The pressing portion can elastically deform to accommodate minor misalignments and maintain continuous contact pressure, making the connection adaptive to external forces rather than rigid and brittle like screw connections.
2Manufacturing precision
If conventional screw connection is used, then the driver board is fixed to the DMD chip, but high precision in structural parts' sizes and installation is required
Solution Approach 1:
The invention changes the connection mechanism from rigid mechanical screw fixation to elastic pressing contact. This parameter change in the connection method reduces the sensitivity to dimensional tolerances, allowing for easier manufacturing and assembly without compromising connection stability.
Solution Approach 2:
The elastic protrusion acts as an intermediary element between the fixing frame and the chip substrate. It mediates the connection by providing compliant contact that compensates for variations in structural parts dimensions, reducing the overall precision requirements for the assembly.
3Reliability
If screws are used to connect the driver board, then the connection is achieved, but assembly and dismantlement become inconvenient
Solution Approach 1:
The elastic protrusion enables dynamic assembly and dismantlement. The elastic deformation allows components to be easily inserted and removed without the need for tools or complex procedures, while maintaining stable connection during operation. This dynamic characteristic resolves the contradiction between connection reliability and ease of repair.
4Reliability
If the pressing portion contacts the chip substrate, then stable contact is ensured, but damage to ceramic parts must be prevented
Solution Approach 1:
The pressing portion is designed with specific material and geometric parameters that change the contact characteristics. By using elastic materials and optimizing the pressing area, the contact pressure is distributed to prevent ceramic damage while maintaining stable electrical contact.
Solution Approach 2:
The elastic protrusion provides beforehand cushioning by its inherent elasticity. It absorbs excess contact pressure before it can damage the ceramic parts, while still maintaining sufficient contact force for stable electrical connection. This prior cushioning effect protects the fragile ceramic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures precise and stable contact between the DMD chip and driver board, improving image quality, reducing assembly and dismantlement difficulties, and lowering the precision requirements for structural elements, thus enhancing production efficiency and reducing costs.
Implementation Method 1
an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion
Data Source
AI summary
The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.