DMD Chip Clamping via Leaf Spring for Automotive Headlamp
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Solution Overview
Problem
Existing light modules for motor vehicle headlights with DMD chips face challenges in securely mounting and cooling the DMD chip, leading to potential damage from excessive contact pressure and vulnerability to vibrations, as well as susceptibility to dust particles affecting light distribution.
Innovation Solution
The light module incorporates a cooling element assembly with a carrier element window, an elastic connecting element like a leaf spring, and adhesive connections to securely hold the DMD chip, while maintaining a dust-tight sealed interior to prevent dust from affecting the light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the DMD chip is securely mounted with strong contact force, then mounting reliability is improved, but the chip may be damaged from excessive contact pressure
Solution Approach 1:
The patent uses an elastic connecting element that changes the contact force parameter dynamically. The element is designed to exert a contact force within a specific range (40-110 N) that is sufficient for secure mounting but below the damage threshold of the DMD chip. This resolves the contradiction by finding an optimal parameter value that satisfies both requirements simultaneously.
Solution Approach 2:
The elastic connecting element acts as a cushioning mechanism that prevents excessive contact force from being applied to the DMD chip. By incorporating this elastic element beforehand in the mounting structure, the system protects the chip from damage while maintaining secure attachment, thus resolving the contradiction between mounting reliability and chip protection.
2Strength
If rigid screw connections are used to secure the cooling element assembly, then connection strength is improved, but the circuit board is subjected to excessive holding forces and vibration
Solution Approach 1:
The patent replaces rigid screw connections with an elastic connecting element that changes the mechanical parameters of the connection. The elastic element provides sufficient connection strength while reducing the holding forces transmitted to the circuit board, thereby maintaining circuit board stability and reducing vibration susceptibility.
Solution Approach 2:
The elastic connecting element functions as a flexible mechanical component that absorbs stresses and vibrations. This flexible connection maintains the necessary structural strength while protecting the circuit board from excessive forces, thus resolving the contradiction between connection strength and circuit board stability.
3Ease of manufacture
If the DMD chip is exposed to the environment, then assembly simplicity is improved, but dust particles can affect light distribution
Solution Approach 1:
The patent implements a nested structure where the DMD chip is positioned within a carrier element window opening. The circuit board is arranged with its front side facing the rear side of the central carrier element, creating a nested arrangement that protects the DMD chip from dust while maintaining assembly simplicity. The micromirrors are arranged in the opening of the carrier element window, allowing light to pass through while the surrounding structure prevents dust contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures secure mounting and cooling of the DMD chip, minimizing damage from vibrations and maintaining precise light distribution by controlling contact pressure and preventing dust interference, thus enhancing the reliability and performance of the light module.
Implementation Method 1
The light module comprises an elastically deformed elastic connecting element, wherein the elastic connecting element is a leaf spring having at least one cooling element assembly-side end and at least one carrier element-side end
Implementation Method 2
the cooling element assembly comprises a cooling stamp that is supported on the rear side of the DMD chip through the circuit board window
Data Source
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AI summary
The invention relates to a lighting module (16; 160) for a motor vehicle headlamp (10), having a printed circuit board (26) which bears a DMD chip (22) that has a front side (224) bearing micromirrors (222) and a rear side, and having a central carrier element (28) and a cooling element assembly 30. The lighting module (16; 160) is distinguished in that: the central carrier element (28) has a carrier element window (286); the printed circuit board (26) is arranged such that the front side (224) of the DMD chip (22) covers the carrier element window (286), wherein the micromirrors (222) are arranged to be visible through an opening in the carrier element window (286); the printed circuit board (26) has a printed circuit board window (264); and the cooling element assembly (30) has a cooling stamp (302) which is supported in a spring-loaded manner through the printed circuit board window (264) on the rear side (226) of the DMD chip (22).