DMD Chip Heat Dissipation Member with Beam Blocking Opening
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Solution Overview
Problem
In DLP projection devices, the DMD chip experiences heat accumulation due to intensive illumination and high operational temperatures, leading to potential damage and reduced reliability, as the existing designs struggle to effectively manage temperature distribution and prevent overheating in the non-operational regions.
Innovation Solution
A projection equipment design featuring a housing with a first heat dissipation member positioned between the DMD chip and the housing, which includes a second opening to allow the illumination beam to pass through and irradiate only on the operational region while blocking other portions, thereby reducing the risk of overheating and maintaining the integrity of the DMD chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the illumination beam is allowed to pass through the first opening and irradiate the DMD chip, then the operational region can be illuminated to create the image, but the non-operational region also receives illumination causing heat accumulation and temperature rise
Solution Approach 1:
The patent segments the DMD chip surface into operational region and non-operational region, and correspondingly segments the heat dissipation member into multiple heat dissipation units that can independently manage heat from different regions. This segmentation allows selective heat management where only necessary regions are illuminated and heated, while other regions are protected from excessive heat accumulation.
Solution Approach 2:
The patent extracts the harmful illumination from the non-operational region by using the heat dissipation member with selectively arranged heat dissipation units. These units are positioned to block illumination beams from reaching the non-operational region while allowing beams to pass through to the operational region, thereby removing the source of unnecessary heat accumulation.
2Power
If the DMD chip operates at high power levels to maintain image quality, then the image brightness and quality are improved, but heat accumulation increases leading to reduced reliability and lifespan
Solution Approach 1:
The patent converts the harmful heat accumulation effect into a beneficial heat dissipation mechanism. The heat dissipation member with selectively arranged heat dissipation units is positioned to allow illumination beams to pass through the operational region (where heat generation is necessary for image creation) while blocking beams from the non-operational region. This design allows the system to operate at high power levels for improved image quality while simultaneously managing heat to maintain reliability.
3Temperature
If the heat dissipation member is placed close to the DMD chip to improve heat dissipation efficiency, then heat management is improved, but the structural complexity and difficulty of assembly increase
Solution Approach 1:
The heat dissipation member serves multiple functions simultaneously: it acts as a heat dissipation component, a beam blocking structure, and a support element for the DMD chip. The selectively arranged heat dissipation units are integrated into the heat dissipation member, which is itself integrated with the housing structure. This multi-functionality reduces the need for separate components and simplifies the overall assembly structure while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the probability of overheating in non-operational regions, prevents epoxy adhesive stratification, and enhances the reliability and stability of the DMD chip by ensuring that only the operational region is exposed to the illumination beam, thus prolonging the chip's lifespan and maintaining optimal performance.
Implementation Method 1
the first heat dissipation member is arranged with a second opening which is configured to provide a passage for the portion of the beam that passes through the first opening and irradiates onto the operational region, while blocking other portion of the beam that passes through the first opening
Data Source
AI summary
A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.