Digital Micro-Mirror Device Heat Dissipation Structure

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Solution Overview

Problem

The existing heat dissipation structures in digital micro-mirror devices fail to maintain a safe temperature difference between the front and rear surfaces, leading to excessive heat retention and a shortened service life due to high illumination intensity.

Innovation Solution

A heat dissipation structure comprising a digital micro-mirror unit, a thermally insulated DMD mask, a thermoelectric cooler, and a thermo-conductive body, where the thermos-insulation element prevents heat transfer from the DMD mask to the micro-mirror unit, while the TEC and thermo-conductive body manage heat dissipation to maintain safe temperature differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipation structure is arranged behind the DMD to dissipate heat from the rear, then the temperature at the rear of the DMD is reduced, but the temperature of the front of the DMD and DMD mask remains relatively high, causing the temperature difference to exceed safety standards

Engineering Contradiction:
Improvetemperature at rear of DMDVSAvoidtemperature difference safety compliance
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat dissipation system is segmented into two independent parts: a rear heat dissipation structure for cooling the back surface, and a front heat dissipation structure (including heat dissipation fins and heat dissipation holes in the DMD mask) for cooling the front surface. This segmentation allows independent optimization of heat dissipation for each surface, enabling the temperature difference to be controlled within safety standards while effectively reducing temperatures at both surfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation approach transitions from a single-dimensional rear cooling system to a multi-dimensional heat dissipation system. The DMD mask is designed with heat dissipation holes that allow heat to escape from the front surface, creating a three-dimensional heat dissipation pathway. Additionally, heat dissipation fins extend outward to increase the heat dissipation surface area, effectively adding spatial dimensions to the heat dissipation process.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If high illumination intensity is used for projection, then imaging quality is improved, but heat generation increases, leading to excessive temperature and reduced service life

Engineering Contradiction:
Improveprojection light intensityVSAvoidDMD temperature
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by high-intensity illumination into a manageable thermal management problem. The DMD mask, which traditionally only blocks stray light, is redesigned to include heat dissipation holes that convert the mask into a dual-function component: it continues to block stray light while simultaneously serving as a heat dissipation structure. This allows the system to maintain high illumination intensity for quality projection while using the same optical path to facilitate heat escape.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The DMD mask is transformed from a single-function stray light blocking component into a multi-functional element that simultaneously performs optical isolation and thermal management. The heat dissipation fins attached to the mask further enhance this universality, allowing the same structural element to serve both optical and thermal functions, thereby enabling high illumination intensity operation without excessive temperature rise.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If a DMD mask with black coating is used to reduce light leakage, then imaging quality is improved, but the mask retains heat and becomes disadvantageous to heat dissipation

Engineering Contradiction:
Improveimaging qualityVSAvoidheat retention
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The DMD mask is designed with localized heat dissipation features (heat dissipation holes and fins) while maintaining the black coating for light absorption in other areas. This local quality differentiation allows the mask to simultaneously achieve its optical function of reducing light leakage through the black coating and its thermal function of dissipating heat through the specifically designed heat dissipation structures, thereby resolving the contradiction between imaging quality and heat management.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively insulates the micro-mirror unit from heat conducted by the DMD mask, ensuring temperature differences meet safety standards and extending the service life of the digital micro-mirror device.

Implementation Method 1

The thermoelectric cooler (TEC) is thermally connected to the digital micro-mirror unit. The thermo-conductive body is attached on the hot side of the TEC.

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

The thermo-insulation element is arranged between the digital micro-mirror unit and the digital micro-mirror device mask. The digital micro-mirror unit is thermally insulated against the digital micro-mirror device mask through the thermos-insulation element.

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10365547B2Digital micro-mirror device with a heat dissipation structure
Publication Date: 2019.07.30 DELTA ELECTRONICS INC(CN)
  • US10365547B2 patent drawing
  • US10365547B2 patent drawing
  • US10365547B2 patent drawing

AI summary

A digital micro-mirror unit is arranged on a circuit board. A digital micro-mirror device mask surroundingly covers the digital micro-mirror unit. A thermo-insulation element is arranged between the digital micro-mirror unit and the digital micro-mirror device mask. The digital micro-mirror unit is thermally insulated against the digital micro-mirror device mask through the thermos-insulation element. A thermoelectric cooler (TEC) is thermally connected to the digital micro-mirror unit. A thermo-conductive body is attached on the hot side of the TEC. Therefore the digital micro-mirror unit can meet temperature requirements of safety standards and avoid reducing its service life.