DMF-Stabilized Acetylene for PECVD Thickness Uniformity

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Solution Overview

Problem

Acetylene stabilization with acetone in semiconductor processing leads to inconsistent deposition rates and thickness uniformity issues due to varying acetone concentrations in the gas stream as the acetylene is consumed, limiting the usable amount of acetylene to about 20% before film quality degrades.

Innovation Solution

Using a low-vapor pressure solvent like dimethylfluoride (DMF) to stabilize acetylene, which maintains a consistent stabilizer concentration in the gas stream throughout the life of the bottle, allowing over 95% of the acetylene to be used without significant degradation in film quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If acetone is used to stabilize acetylene, then acetylene can be stored and transported safely, but the acetone concentration in the gas stream varies substantially as acetylene is consumed, degrading film quality

Engineering Contradiction:
Improveacetylene storage safetyVSAvoidfilm thickness uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the chemical parameter of the stabilizer from acetone to a different compound with lower vapor pressure, fundamentally altering the stabilization mechanism to prevent vapor concentration variations that degrade film quality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a new stabilizer compound as an intermediary substance that mediates between acetylene storage safety requirements and deposition process quality requirements, eliminating the harmful vapor concentration fluctuations

Inventive Principle:
Principle #24Intermediary (Mediator)

2Quantity of substance

If acetone-stabilized acetylene is used, then initial deposition works, but usable acetylene amount is limited to about 20% before film quality degrades

Engineering Contradiction:
Improveusable acetylene amountVSAvoidfilm quality
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent changes the vapor pressure parameter of the stabilizer from high (acetone) to low (new compound), which fundamentally alters how the stabilizer behaves in the gas stream throughout acetylene consumption, enabling consistent film quality over 95%+ usage

Inventive Principle:
Principle #35Parameter changes

3Productivity

If acetylene is consumed from the tank, then deposition continues, but acetone content in the gas stream increases, impacting product quality

Engineering Contradiction:
Improvedeposition continuityVSAvoidproduct quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the vapor pressure parameter of the stabilizer to be lower, which prevents the stabilizer concentration from increasing as acetylene is consumed, thereby maintaining product quality throughout continuous deposition operations

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The new stabilizer compound acts as an intermediary that enables continuous deposition by mediating between the need for acetylene consumption and the requirement to maintain consistent gas stream composition for product quality

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

DMF-stabilized acetylene bottles provide consistent film thickness and deposition rates, increasing the usable acetylene amount and maintaining film quality over the life of the bottle, unlike acetone-stabilized bottles which degrade after 20% usage, resulting in improved wafer-to-wafer thickness uniformity and increased processing capacity.

Implementation Method 1

Acetylene is highly soluble in acetone. One volume of liquid acetone can absorb twenty-five volumes of gaseous acetylene at temperatures of about 15° C. under atmospheric pressure

Methodology Applied
Scientific EffectDissolution: Solvation

Implementation Method 2

In using acetylene as a precursor for the deposition of carbon films in chemical vapor deposition (CVD) processes

Methodology Applied
Scientific EffectPlasma enhanced chemical vapor deposition: Plasma Enhanced Chemical Vapour Deposition

Implementation Method 3

Acetylene is then fed into the line for introduction to the deposition chamber

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS7955990B2Method for improved thickness repeatability of PECVD deposited carbon films
Publication Date: 2011.06.07 NOVELLUS SYSTEMS INC
  • US7955990B2 patent drawing
  • US7955990B2 patent drawing
  • US7955990B2 patent drawing

AI summary

Provided herein are improved methods of depositing carbon-based films using acetylene as a precursor. The methods involve using a low-vapor pressure solvent, e.g., dimethylfluoride (DMF) to stabilize the acetylene and delivering the acetylene to a deposition chamber. The methods provide improved wafer-to-wafer thickness uniformity and increase the usable amount of acetylene in an acetylene source to over 95%.