Dockable Cleaning Module for 3D Printing Process Chambers
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Solution Overview
Problem
Existing additive manufacturing systems for three-dimensional objects face contamination issues within process chambers, which can negatively affect the operation of devices and functional components by influencing energy beams used in the manufacturing process.
Innovation Solution
A system incorporating a dockable cleaning module with a cleaning device that can be coupled to the process chamber, featuring a flow device and/or a wiping device for automated cleaning, allowing for chemical and physical removal of deposits, and equipped with antistatic substances to prevent static charging, ensuring flexible and practical cleaning options for process chambers and functional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a process chamber is used for additive manufacturing, then three-dimensional objects can be produced by selective exposure and hardening of building material layers, but contamination accumulates in the process chamber that negatively affects energy beam operation and device performance
Solution Approach 1:
The system is divided into modular components including a process chamber module and a cleaning module that can be independently docked and removed. This segmentation allows the cleaning module to be attached only when needed, maintaining manufacturing precision while addressing contamination issues without requiring permanent integration of cleaning equipment into the manufacturing system.
Solution Approach 2:
A docking interface acts as an intermediary between the process chamber and the cleaning module. This intermediary mechanism enables the cleaning module to couple with and clean the process chamber, then be removed without interfering with the additive manufacturing process. The docking interface mediates between the conflicting requirements of maintaining a clean chamber for precision manufacturing and allowing contamination to occur during normal operation.
2Reliability
If the process chamber is cleaned frequently to remove contaminants, then energy beam performance is maintained, but production time is lost and productivity decreases
Solution Approach 1:
The cleaning system is designed to be dynamic rather than static, allowing the cleaning module to be docked and removed as needed based on contamination levels. This dynamic approach enables flexible scheduling of cleaning operations, maintaining energy beam reliability while minimizing interruptions to manufacturing productivity through on-demand cleaning rather than fixed frequent cleaning cycles.
Solution Approach 2:
The system incorporates self-service cleaning capabilities where the cleaning module can be autonomously docked and operated to clean the process chamber without requiring complete system shutdown or external intervention. This self-service approach maintains reliability by keeping the chamber clean when needed while preserving productivity through automated cleaning operations that do not require prolonged production stoppages.
3Object-affected harmful factors
If a permanent cleaning system is integrated into the device, then contamination is continuously removed, but device complexity increases and flexibility is reduced
Solution Approach 1:
The cleaning system is segmented into a separate dockable module rather than being permanently integrated into the device structure. This segmentation reduces overall device complexity by keeping the cleaning functionality isolated in a standalone module that only couples with the process chamber when needed, rather than requiring complex integrated cleaning mechanisms built into the manufacturing device itself.
Solution Approach 2:
The cleaning module is designed as a universal component that can be docked with the process chamber to perform cleaning functions, then removed to allow normal manufacturing operations. This multi-functional module serves both as a cleaner and as a space-saving component that does not permanently occupy space within the manufacturing device, reducing structural complexity while maintaining effective contamination removal capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively removes contaminants from process chambers and functional components, maintaining the integrity of energy beams and ensuring consistent performance in additive manufacturing processes.
Implementation Method 1
a flow device which is set up to generate a flow that removes contaminants from a process chamber
Implementation Method 2
a wiping device which is set up to generate a wiping movement of a wiping element that can be set into a wiping movement along a surface of a process chamber to be cleaned
Implementation Method 3
equipped with antistatic substances to prevent static charging
Data Source
Figure 1~2
Figure 3
AI summary
Plant (1) for the additive manufacturing of three-dimensional objects (2), comprising: - a device (3) which is set up for the additive manufacturing of a three-dimensional object, wherein the device (3) comprises a process chamber (9) within which additive manufacturing processes for the additive manufacturing of three-dimensional objects (2) can be carried out, - a powder module (11a - 11c) dockable to the process chamber (9) of the at least one device (3), which comprises a receiving chamber for receiving building material (4) to be solidified or unsolidified within the scope of an additive manufacturing process and/or a three-dimensional object (2) to be additively manufactured or manufactured within the scope of an additive manufacturing process, - a cleaning module (13) dockable to the process chamber (9) of the at least one device (3), which comprises a cleaning device (14) which is for the automatable or automated at least section-by-section, in particular complete,Cleaning of the process chamber (9) or of a functional component of the device (3) arranged or formed within the process chamber (9) is included.