Docking Detector Receptacle Thermal Management for X-ray Imaging

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Solution Overview

Problem

Conventional digital X-ray detectors face challenges with heat dissipation and diagnostic testing, as existing thermal cooling methods are cumbersome, expensive, and inefficient, and there is a need for more effective cooling and diagnostic solutions to ensure device functionality and patient safety.

Innovation Solution

A docking detector receptacle system with a back surface and pocket for heat dissipation, using layers of isolation foam and carbon fiber in the portable digital X-ray detector, combined with thermal-electric controllers and airflow slots, to efficiently manage heat and perform diagnostic tests during idle periods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional liquid-based recirculating heat-exchangers are used for cooling, then heat dissipation capability is improved, but device complexity and cost increase significantly

Engineering Contradiction:
Improvedetector surface temperatureVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts the cooling function from the detector assembly itself and places it in a separate docking station. The detector contains only passive thermal management components (isolation foam, carbon fiber layer) while the active cooling system (thermal-electric controller, airflow slots) is located in the docking station, simplifying the detector design and reducing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a docking station as an intermediary between the detector and the cooling system. This intermediary contains the thermal-electric controller and airflow slots, acting as a mediator that provides active cooling when the detector is docked, while allowing the detector to remain simple and portable during use.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If passive thermal management alone is used, then device simplicity is maintained, but heat dissipation effectiveness is insufficient

Engineering Contradiction:
Improvecooling system structureVSAvoidheat dissipation effectiveness
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent combines multiple thermal management approaches: passive thermal isolation (foam layers, carbon fiber) within the detector is merged with active cooling mechanisms (thermal-electric controller, airflow slots) in the docking station. This hybrid approach maintains detector simplicity while achieving effective heat dissipation through the integrated system.

Inventive Principle:
Principle #5Merging (Combining)

3Productivity

If diagnostic testing is performed only during initial calibration, then device operational time is maximized, but detector reliability cannot be ensured during idle periods

Engineering Contradiction:
Improvedetector availabilityVSAvoiddetector functionality
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent implements continuous diagnostic testing during idle periods through the docking station. The electrical interface enables automated diagnostic tests to be performed continuously whenever the detector is docked, ensuring reliability is maintained without reducing detector availability, as testing occurs during non-productive docking time.

Inventive Principle:
Principle #20Continuity of useful action

4Temperature

If active cooling is implemented in the detector itself, then heat dissipation is improved, but manufacturing cost increases

Engineering Contradiction:
Improvecooling effectivenessVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent extracts the expensive active cooling components (thermal-electric controller, airflow slots) from the detector and places them in the docking station. The detector itself only requires simple passive thermal management components that are inexpensive to manufacture, while the docking station handles the costly active cooling functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively cools the digital X-ray detector, reduces surface temperature, and ensures the device is operational by integrating thermal management and diagnostic testing capabilities, enhancing patient throughput and operator confidence.

Implementation Method 1

A portable digital X-ray detector may include a first layer of isolation foam, a panel, a second layer of isolation foam, a layer of carbon fiber, a third layer of isolation foam, and a case

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

a layer of carbon fiber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7997798B2Multi-purpose docking apparatus of digital X-ray detector
Publication Date: 2011.08.16 GE PRECISION HEALTHCARE LLC
  • US7997798B2 patent drawing
  • US7997798B2 patent drawing
  • US7997798B2 patent drawing

AI summary

Systems, methods and apparatus are provided through which in some implementations a docking detector receptacle includes apparatus to cool a portable digital X-ray detector. In addition, systems, methods and apparatus are provided through which in some implementations communication authorization is established between a portable digital X-ray detector and a docking detector receptacle, and communication is performed between the portable digital X-ray detector and the docking detector receptacle using the authorization. In addition, systems, methods and apparatus are provided through which in some implementations a portable digital X-ray detector includes a panel, isolation at least three isolation foam layers, a motherboard and a carbon fiber layer.