Doherty High-Frequency Amplifier Layout for Heat-Dense 3D Packaging
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Solution Overview
Problem
High-frequency amplifiers face challenges in reducing size while maintaining heat dissipation properties, especially when using three-dimensional mounting which can deteriorate heat dissipation due to large power and current consumption.
Innovation Solution
A high-frequency amplifier design utilizing a two-level structure with multilayer substrates and a base member for mounting driver, carrier, and peak amplifiers, where the driver amplifier is supported by a heat dissipation path and the carrier and peak amplifiers make contact with the base member for efficient heat dissipation, reducing size and increasing packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If three-dimensional mounting is used to reduce size, then packaging density is improved, but heat dissipation properties deteriorate
Solution Approach 1:
The patent transitions from two-dimensional planar mounting to three-dimensional stacked mounting by placing the driver amplifier on a first substrate and the Doherty amplifier on a second substrate that overlaps the first substrate in the vertical direction. This dimensional change enables compact packaging while maintaining heat dissipation through dedicated thermal pathways.
Solution Approach 2:
The patent segments the amplifier system into distinct functional modules (driver amplifier and Doherty amplifier) mounted on separate substrates. This segmentation allows independent thermal management for each amplifier, with the Doherty amplifier's back surface directly contacting the base member for heat dissipation while the driver amplifier uses a separate heat dissipation path.
2Temperature
If driver amplifier back surface is separated from first multilayer substrate, then heat dissipation path is optimized, but structural support is reduced
Solution Approach 1:
The patent introduces an intermediary heat dissipation path (via holes or thermal vias) that connects the driver amplifier's back surface to the base member without requiring direct contact. This intermediary pathway enables effective heat dissipation while maintaining the structural integrity and spacing between the driver amplifier and the first multilayer substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact size with improved heat dissipation properties by optimizing the placement and connection of amplifiers within the two-level structure, supporting the driver amplifier with a heat dissipation path and allowing the carrier and peak amplifiers to dissipate heat effectively.
Implementation Method 1
the back surface of the driver amplifier is connected to one end of a first via penetrating the second multilayer substrate and the first multilayer substrate, and the other end of the first via is connected to the base member
Implementation Method 2
the back surfaces of the carrier amplifier and the peak amplifier both make contact with the base member, respectively
Data Source
AI summary
A high-frequency amplifier includes a driver amplifier, a Doherty amplifier including carrier and peak amplifiers which amplify the driver amplifier output, a second substrate laminated on a first substrate, and a base member mounted with the first and second substrates. The driver amplifier is mounted on the second substrate, and the carrier and peak amplifiers are mounted on the first substrate. A front surface of the driver amplifier opposes the first substrate, and a back surface of the driver amplifier is separated from the first substrate. Back surfaces of the carrier and peak amplifiers contact the base member, and the back surface of the driver amplifier connects to an interconnect layer disposed on the second substrate and connected to one end of a via penetrating the second and first substrates, and the other end of the via connects to the base member.