N-Way Doherty Amplifier Matching for Low-Impedance Package Integration
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Solution Overview
Problem
It is challenging to realize matching circuits that effectively match impedances between the main amplifier and the impedance converter, and between the peak amplifiers and the impedance converter, in N-way Doherty amplifier circuits.
Innovation Solution
The semiconductor device includes a package with a base and output lead, multiple semiconductor chips for amplifiers, impedance converters, and matching circuits. These components are strategically connected to ensure impedance matching and phase shifting, allowing for the realization of matching circuits with low characteristic impedances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If matching circuits are added to match impedances between amplifiers and impedance converter, then impedance matching performance is improved, but device complexity increases
Solution Approach 1:
The patent introduces matching circuits as intermediary components between the amplifiers and the impedance converter. These matching circuits serve as mediators that transform the impedance levels to achieve proper matching, thereby improving impedance matching performance without requiring fundamental changes to the amplifier or impedance converter designs.
Solution Approach 2:
The patent divides the impedance matching function into separate matching circuits for different signal paths (main amplifier path and peak amplifier paths). By segmenting the matching function into discrete, modular circuits, the overall system complexity is managed while achieving effective impedance matching at each interface.
2Area of stationary object
If multiple matching circuits and impedance converters are integrated on the same substrate, then circuit size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges multiple functional components (main amplifier, peak amplifiers, impedance converters, and matching circuits) onto a single circuit substrate. This integration consolidates what would otherwise be separate discrete components, reducing the overall circuit size while distributing the mounting precision requirements across standardized component positions.
Solution Approach 2:
The circuit substrate is designed as a universal platform that accommodates multiple different component types (amplifiers, impedance converters, matching circuits) with standardized mounting interfaces and electrical connections. This multi-functional substrate design simplifies the manufacturing process by using consistent mounting procedures for diverse components.
Data Source
AI summary
A semiconductor device includes a package that includes a base and an output lead, a first semiconductor chip that includes a main amplifier and a first output pad for outputting an amplified first signal, a second semiconductor chip that includes a first peak amplifier and a second output pad for outputting an amplified second signal, a third semiconductor chip includes a second peak amplifier and a third output pad for outputting an amplified third signal, a first impedance converter that has a first end connected to the first output pad and the output lead, and a second end connected to the second output pad and the third output pad, a first matching circuit that matches impedances of the first output pad and the first end with each other, and a second matching circuit matches impedances of the second output pad and the second end with each other.