Doherty Amplifier Wirebond Interleaving for Uniform RF Output
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In Doherty amplifiers, non-uniform signal distribution due to separate wirebond arrays connecting to different regions of the amplifier's output terminals leads to degraded RF performance and frequency-dependent changes in output power, gain, and efficiency.
Innovation Solution
Interleaving wirebond arrays connected to the drain terminals of the peaking and carrier amplifiers to uniformly distribute signals across the combining node and output transformer, ensuring uniform signal feed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate wirebond arrays are used to connect the peaking amplifier's drain terminal to different components, then the amplifier can be configured with Doherty architecture, but non-uniform current flow results in degraded RF performance and power dispersion across frequencies
Solution Approach 1:
The patent combines multiple wirebond arrays into a single integrated wirebond structure that connects the peaking amplifier drain terminal to multiple components (output transformer, quasi-transmission line, shunt-inductor networks) simultaneously. This merging eliminates the non-uniform current distribution caused by separate wirebond arrays while maintaining the Doherty amplifier configuration, thereby resolving the contradiction between architectural versatility and performance uniformity
2Ease of manufacture
If separate wirebond arrays connect to different regions of the drain terminal, then component connectivity is achieved, but non-uniform current distribution causes power dispersion across frequencies
Solution Approach 1:
The patent implements local quality by designing the integrated wirebond structure with specific connection points and distribution characteristics tailored to each component. The wirebond array is configured to provide uniform current distribution to each connected component (output transformer, quasi-transmission line, shunt-inductor networks) while maintaining ease of manufacture through a standardized integrated structure
Data Source
AI summary
A device includes a Doherty amplifier having a first amplifier die having a first output terminal, and a second amplifier die with a second output terminal. A device may include an output impedance matching network connected to an output terminal of the Doherty amplifier. A device may include an impedance inversion element connected to the second output terminal of the second amplifier die. A device may include a first wirebond array connected between the first output terminal of the first amplifier die and the output impedance matching network. A device may include a second wirebond array connected between the first output terminal of the first amplifier die and the impedance inversion element, wherein wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array.