Dolmen Chip Assembly Using Resin Support Pieces for Stable Lamination
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Solution Overview
Problem
The manufacturing process of semiconductor devices with a dolmen structure is complex and costly due to the need for back grinding and dicing of semiconductor wafers to create support pieces, which are then used to laminate chips.
Innovation Solution
A manufacturing method using a laminate film with a base material, adhesive layer, and support piece formation film to simplify the preparation of support pieces, eliminating the need for back grinding and reducing costs by using a thermosetting resin layer, which provides high shear strength and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor wafers are used to manufacture support pieces through back grinding and dicing, then the support pieces have high strength and stability, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent replaces expensive semiconductor wafers with inexpensive resin-based support pieces that achieve sufficient mechanical strength for the application. The resin support pieces are manufactured through simple molding processes rather than complex semiconductor fabrication, eliminating back grinding and dicing steps while providing adequate stability for holding chips in the dolmen structure.
Solution Approach 2:
The patent changes the material parameter from semiconductor (silicon) to resin, fundamentally altering the manufacturing approach. This material substitution enables simple molding processes instead of complex semiconductor fabrication processes, reducing manufacturing complexity while maintaining functional requirements through proper resin selection and formulation.
2Strength
If semiconductor wafers are used to manufacture support pieces, then the support pieces provide adequate mechanical strength, but the manufacturing cost increases due to multiple processing steps
Solution Approach 1:
The patent substitutes expensive semiconductor materials with inexpensive resin materials that provide sufficient strength for the support function. The resin support pieces are manufactured through simple molding processes, eliminating costly semiconductor fabrication steps such as back grinding, dicing, and cleaning, thereby significantly reducing manufacturing cost while maintaining adequate mechanical strength.
Solution Approach 2:
The patent extracts and eliminates the unnecessary complexity of semiconductor manufacturing processes (back grinding, dicing, cleaning) from the support piece production. Only the essential function of providing mechanical support is retained, achieved through simple resin molding, thereby reducing manufacturing cost while maintaining the required strength.
3Ease of manufacture
If resin-based support pieces are used instead of semiconductor wafers, then the manufacturing process is simplified and cost is reduced, but the shear strength must be maintained at 3.2 MPa or more
Solution Approach 1:
The patent carefully selects and formulates resin materials with specific mechanical properties to achieve the required shear strength of 3.2 MPa or more. By adjusting resin composition, crosslinking density, and curing conditions, the patent optimizes the mechanical strength parameter while maintaining the simplicity of the molding-based manufacturing process.
Solution Approach 2:
The patent may employ composite resin formulations combining multiple polymers, fillers, and additives to achieve the required shear strength. The composite structure allows optimization of mechanical properties while maintaining the simple manufacturing process, as the composite materials can be directly molded into the final support piece shape without additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the preparation of support pieces, reduces costs, and ensures stable lamination of semiconductor chips with high connection reliability by using resin-based support pieces with a shear strength of 3.2 MPa or more.
Implementation Method 1
a support piece formation film including at least a thermosetting resin layer... a shear strength of the support pieces and the bonding adhesive piece-attached chip... is 3.2 MPa or more
Data Source
AI summary
A semiconductor device having a dolmen structure, includes: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip, on the substrate; and a bonding adhesive piece-attached chip supported by the plurality of support pieces and disposed to cover the first chip, in which the bonding adhesive piece-attached chip includes a second chip, and a bonding adhesive piece provided on one surface of the second chip, and a shear strength of the support pieces and the bonding adhesive piece-attached chip at 250° C. is 3.2 MPa or more.