Magnetic Domain Wall Element Via Layout for Stable Data Writing
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Solution Overview
Problem
The reliability of data held by magnetic domain wall motion elements is compromised due to the magnetic field generated by the write current flowing through the wiring, affecting the magnetization of the element.
Innovation Solution
The magnetic domain wall motion element is designed with a specific via wiring configuration where the positions of the via wirings are arranged to minimize the influence of the magnetic field generated by the write current, ensuring the magnetization of the first ferromagnetic layer remains stable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a write current is applied to the in-plane wiring to write a signal, then data can be written to the magnetic domain wall motion element, but the magnetic field generated by the write current affects the magnetization of the element and reduces data reliability
Solution Approach 1:
The patent introduces via wirings as intermediary conductors that redirect the write current path. Instead of current flowing directly through the in-plane wiring above the magnetic element, the current is routed through via wirings positioned at specific locations (first via wiring connected to first ferromagnetic layer, second via wiring connected to second ferromagnetic layer, third via wiring connected to third ferromagnetic layer). This intermediary routing structure allows signal writing while minimizing direct magnetic field interference with the magnetization of the magnetic domain wall motion element.
Solution Approach 2:
The patent transitions from a two-dimensional in-plane wiring layout to a three-dimensional wiring structure by utilizing via wirings that extend in the stacking direction (vertical dimension). The via wirings are positioned at different heights (first via wiring at first height, second via wiring at second height, third via wiring at third height), creating a multi-layer conductive path that resolves the magnetic field interference issue by changing the spatial dimension of current flow.
2Area of stationary object
If the in-plane wiring is positioned close to the magnetic domain wall motion element for compact design, then device integration is improved, but the magnetic field from write current has greater influence on magnetization
Solution Approach 1:
The patent utilizes the stacking direction (vertical dimension) to separate the magnetic domain wall motion element from the in-plane wiring. The element is positioned at a first position in the stacking direction while the in-plane wiring is positioned at a second position different from the first. This vertical separation maintains compact in-plane footprint while reducing magnetic field interference through increased spatial distance in the third dimension.
Solution Approach 2:
The via wirings serve as intermediary structures that physically connect different magnetic layers at specific locations while allowing the in-plane wiring to be positioned away from the magnetic element. This intermediary connection system enables compact integration without requiring the in-plane wiring to be immediately adjacent to the magnetic domain wall motion element, thus reducing harmful magnetic field effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the impact of the write current's magnetic field on the magnetization, enhancing the reliability of data storage and operation in magnetic domain wall motion elements.
Implementation Method 1
a first ferromagnetic layer; a position of the in-plane wiring in a stacking direction is different from that of the first ferromagnetic layer
Implementation Method 2
A magnetic field generated when a write current flows through a wiring may affect a magnetization of the magnetic domain wall motion element
Data Source
AI summary
A magnetic domain wall motion element includes a first ferromagnetic layer, in-plane wiring, and first, second and third via wirings. A position of the in-plane wiring in a stacking direction is different from that of the first ferromagnetic layer. The first via wiring connects the first ferromagnetic layer and in-plane wiring. The second via wiring is connected to the in-plane wiring at a different position from the first. The third via wiring is connected to the in-plane wiring at a different position from the first and second. When positions of the second and the third via wirings are projected on an axis passing through a center of the first via wiring when viewed in the stacking direction and extending in a second direction, the first via wiring is interposed between projection points of the second and third via wirings to the axis in the second direction.