Dome-Shaped Electrode Passive Component Mounting Alignment
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Solution Overview
Problem
As electronic devices become smaller, passive components on circuit boards face misalignment issues due to reduced land patterns and solder amounts, leading to shifting during mounting, especially with monohedral electrode structures that exacerbate these problems.
Innovation Solution
A passive component with a substrate body having insulation properties, an internal conductor, and external electrodes with dome-shaped projections on the mounting surface, which increase the contact area with solder, preventing misalignment by ensuring secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If passive components are made smaller and land patterns are reduced, then component size and footprint are decreased, but mounting precision and alignment stability deteriorate
Solution Approach 1:
The external electrode is designed with a dome-shaped projection instead of a flat surface. This curved geometry increases the contact area with the solder, providing better mechanical interlocking and preventing misalignment during mounting. The spherical cap shape allows the electrode to bite into the solder more effectively, ensuring stable positioning even when components are miniaturized.
Solution Approach 2:
The invention adds a vertical dimension to the external electrode by creating a dome-shaped projection that bulges outward from the mounting surface. This three-dimensional structure increases the effective contact area with the solder in the vertical direction, enhancing mounting precision without increasing the horizontal footprint of the component.
2Productivity
If solder amount is reduced for smaller land patterns, then component density increases, but solder joint strength and positioning stability deteriorate
Solution Approach 1:
The dome-shaped projection concentrates the contact force onto a curved surface that bites into the solder, creating strong mechanical interlocking. This curved geometry allows effective solder joint formation with reduced solder volume, as the projection ensures proper alignment and maintains joint integrity even with minimal solder material.
Solution Approach 2:
The invention changes the geometric parameters of the external electrode by introducing a dome-shaped projection with specific curvature radius and height. This parameter modification increases the contact pressure and mechanical interlocking with the solder, compensating for the reduced solder amount and maintaining joint strength while enabling higher component density.
Data Source
AI summary
In an exemplary embodiment, a passive component which is a surface mounting component, includes: a substrate body 10 having insulation property; an internal conductor 50 embedded in the substrate body 10; and an external electrode 70 provided on the bottom face 12, which is the mounting surface, of the substrate body 10 and electrically connected to the internal conductor 50; wherein the external electrode 70 has a face 86 roughly parallel with the bottom face 12 of the substrate body 10, and a dome-shaped projection 80 that bulges, with reference to the roughly parallel face 86, away from the bottom face 12 of the substrate body 10. The passive component can prevent misalignment problems at mounting.