Dome Shaped LTCC Substrates Fabrication via Segmented Stacking
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Solution Overview
Problem
Microelectronic ceramic circuit technologies, such as LTCC circuits, often require non-tubular curved shapes for applications, but using planar or tubular shapes leads to electrical signal loss due to additional connectors and modified packaging needs, which compromises performance.
Innovation Solution
A system and method for fabricating dome or complex-shaped ceramic substrates using prefired substrates with a central circular portion and segments, stacked and fired on mandrels with decreasing circumferences to achieve a monolithic, curved LTCC substrate with improved uniformity and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If planar or tubular shaped LTCC circuits are used, then manufacturing is simpler, but additional electrical connectors are required which introduce signal loss and reduce performance
Solution Approach 1:
The patent applies curvature by forming the LTCC substrate into a dome shape that directly matches the curved surface of the housing. This eliminates the need for flat connectors and wiring harnesses, allowing electrical connections to be made directly on the curved substrate surface, thereby maintaining signal integrity while achieving the desired curved form factor
2Device complexity
If planar or tubular shaped LTCC circuits are used, then device complexity is lower, but additional connectors and modified packaging are required
Solution Approach 1:
The patent merges the LTCC substrate with the curved housing by forming the substrate in a dome shape that integrates directly with the housing surface. This consolidation eliminates separate connectors and wiring assemblies, reducing device complexity while maintaining electrical performance through direct trace routing on the integrated curved substrate
3Manufacturing precision
If dome shaped ceramic substrates are fabricated using segmented prefired substrates, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The patent segments the dome-shaped substrate into multiple prefired circular substrates stacked in sequence. Each segment is fired independently to achieve precise dimensional control and uniformity, then stacked and co-fired to form the complete dome structure. This segmentation enables manufacturing precision that would be difficult to achieve in a single-piece construction
Solution Approach 2:
The patent applies preliminary action by pre-firing individual circular substrates to their final dimensions before stacking. This preliminary firing ensures each segment achieves the required precision and uniformity independently, reducing the complexity of controlling the entire dome structure in a single firing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach allows for the creation of high-performance, curved ceramic substrates with reduced electrical signal loss and simplified packaging, enhancing the operational efficiency of microelectronic components.
Implementation Method 1
firing the stack of prefired substrates and the second mandrel
Data Source
AI summary
A system for the fabrication of dome shaped low temperature cofired ceramic (LTCC) substrates comprises a plurality of prefired substrates, a first mandrel, and a second mandrel. The prefired substrates may form a stack and each may include a circular central portion and a plurality of segments uniformly distributed along the circumference of the central portion. Each segment may include a first edge, an opposing second edge, and an end edge. The first and second edges each may have an inner end and an opposing outer end. The end edge may be coupled to the outer end of the first and second edges. The first mandrel may have a first circumference and may be configured to receive the prefired substrates while the stack is formed. The second mandrel may have a second circumference smaller than the first circumference and may be configured to retain the stack during a firing process.