Dome Switch Card Cover Layering for Click Sensation
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Solution Overview
Problem
Conventional cards with built-in electronic components, such as IC cards, fail to provide a satisfactory button click sensation due to the design of the power on/off switch, which includes an adhesive layer between the switch part and a resin film layer, resulting in an unsatisfactory click experience.
Innovation Solution
A card with a built-in electronic component that incorporates a metal dome switch with a laminate cover member composed of a resin film layer, an adhesive layer, and another resin film layer, allowing the dome switch to be temporarily fixed to the substrate during manufacturing and securely retained post-manufacture, enhancing the click sensation and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an adhesive layer is formed between the switch part and resin film layer to fix the dome switch, then the dome switch can be retained on the substrate, but the click sensation obtained by depressing the switch is unsatisfactory
Solution Approach 1:
The invention divides the cover member into multiple functional layers: a first resin film layer in contact with the dome switch, an adhesive layer for retention, and a second resin film layer providing operational feedback. This segmentation allows each layer to perform its specific function without interfering with the click sensation.
Solution Approach 2:
The invention applies different material properties to different parts of the cover member. The first resin film layer has specific properties for dome switch contact, while the second resin film layer is designed to provide click sensation. This local differentiation resolves the contradiction between retention and operational feedback.
2Ease of manufacture
If the dome switch is fixed using conventional adhesive methods, then manufacturing is simplified, but misalignment of the dome switch relative to the substrate occurs
Solution Approach 1:
The invention incorporates positioning protrusions on the substrate and corresponding positioning recesses on the dome switch before the adhesive bonding process. This preliminary mechanical positioning ensures accurate alignment is achieved before the adhesive sets, preventing misalignment while maintaining manufacturing simplicity.
3Device complexity
If a single-layer resin film is used as the cover member, then the structure is simple, but the dome switch cannot be temporarily fixed during manufacture and retained post-manufacture
Solution Approach 1:
The cover member is segmented into three distinct layers with specific functions: the first resin film layer for dome contact, the adhesive layer for temporary and permanent fixation, and the second resin film layer for retention and protection. This segmentation enables both temporary fixing during manufacture and reliable retention after manufacture.
Solution Approach 2:
The invention uses a composite structure combining different material properties in each layer. The adhesive layer provides bonding capability, while the resin film layers provide structural integrity and retention. This composite approach achieves reliable retention without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a superior click sensation when operating the dome switch from the card surface, improving user experience and ensuring reliable operation and durability of the switch.
Implementation Method 1
the dome switch within the card base can be operated comfortably from a card surface
Implementation Method 2
the member including the adhesive layer and the resin film layer disposed on the side opposite to the switch part can retain the dome switch on the substrate
Data Source
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Figure 5
AI summary
Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.