Domed-Lid Battery Package Layout for Heat and Expansion Stress
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Solution Overview
Problem
Conventional electronic packages with molded battery holders face issues such as high temperatures affecting battery performance, battery expansion/contraction causing damage, and increased package size due to lateral battery positioning next to components.
Innovation Solution
The use of a domed lid to enclose the battery and die in a compact form factor, eliminating molded holders and lateral positioning, with electrical connections through the domed lid and substrate, using conductive adhesives or metallurgical bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molded battery holders are used to secure batteries, then battery positioning is achieved, but high temperatures affect battery performance and battery expansion/contraction causes damage
Solution Approach 1:
The patent removes the molded battery holder from the package structure entirely. The battery is positioned and secured directly to the lid using adhesive, eliminating the intermediary holder that was susceptible to temperature-related degradation and mechanical damage from battery expansion/contraction.
Solution Approach 2:
The patent changes the thermal and mechanical parameters of the package by eliminating the plastic molded holder and replacing it with a metal lid and adhesive assembly. This configuration provides better thermal management and accommodates battery dimensional changes without structural damage.
2Reliability
If batteries are positioned laterally next to components, then electrical connection is achieved, but package size increases
Solution Approach 1:
The patent transitions from lateral positioning of the battery next to the die to a vertical stacking arrangement. The battery is mounted on the lid directly above the die, with electrical connections established through vertical vias in the lid and substrate, thereby reducing the horizontal footprint of the package.
Solution Approach 2:
The patent merges the battery and die into a single vertical stack within the package cavity, rather than positioning them side-by-side. This consolidation reduces the overall package area while maintaining all necessary electrical connections through the lid and substrate interconnects.
3Stability of the object's composition
If molded battery holders are used, then battery securing is achieved, but the holders are damaged by battery expansion/contraction
Solution Approach 1:
The patent eliminates the molded battery holder entirely, replacing it with a direct adhesive bonding method between the battery and lid. This removes the vulnerable component that was being damaged by battery dimensional changes while maintaining secure battery positioning.
Solution Approach 2:
The patent uses a composite bonding approach combining adhesive materials with the metal lid structure to secure the battery. This composite assembly provides both secure positioning and accommodation of battery dimensional changes without structural failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration addresses temperature-related degradation, reduces package size, and allows for more efficient component integration without damaging the battery holders or other components.
Implementation Method 1
an electrically conductive adhesive material such that the die is sandwiched between the battery and the substrate... electrically connected to at least one electrically conductive via in the die to electrically connect the battery to the substrate
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An electronic package (100) with a battery (102) and method for producing the electronic package uses a domed lid (104) that is attached to a substrate (108) with an electronic component, such as a die (106). The battery (102) is attached to an inner surface of the domed lid and electrically connected to the electronic component via the domed lid.