Donor Substrate Microdevice Layout for Non-Interfering Pad Transfer

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Solution Overview

Problem

Existing micro device transfer processes face interference issues when different types of micro devices from various donor substrates are required on a receiver substrate, leading to inefficiencies and increased processing steps due to extra devices on donor substrates interfering with intended pads on the receiver substrate.

Innovation Solution

The method involves patterning micro devices on donor substrates to create non-interfering areas, allowing for precise alignment and transfer of micro devices to specific pads on the receiver substrate, avoiding interference by using interfering areas to overlap with unintended pads and adjusting the relative position of substrates to prevent micro device interference during transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If micro devices are densely arranged on donor substrate to increase transfer efficiency, then productivity improves, but device interference with unintended pads increases

Engineering Contradiction:

Improvemicro device transfer efficiencyVSAvoiddevice interference with pads

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The donor substrate is divided into multiple independent arrays, each containing micro devices of a specific type. Each array is spatially separated and configured to transfer only to its corresponding pad type, preventing devices from interfering with unintended pads while maintaining high density arrangement within each array.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the donor substrate are assigned different functions: some areas contain arrays of first type micro devices configured for first pad locations, while other areas contain arrays of second type micro devices configured for second pad locations. This local differentiation ensures each device only interferes with its intended target pad.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If multiple types of micro devices are transferred from different donor substrates, then device versatility improves, but processing complexity increases

Engineering Contradiction:

Improvereceiver substrate device configurationVSAvoidtransfer process steps

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The donor substrate is designed with multiple arrays of different micro device types on the same substrate, enabling a single donor substrate to supply multiple device types. This universal design allows the receiver substrate to be populated with different device configurations without requiring multiple separate donor substrates, simplifying the overall transfer process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Quantity of substance

If micro devices are arranged to cover entire donor substrate area, then device quantity increases, but alignment precision with specific pads decreases

Engineering Contradiction:

Improvenumber of micro devicesVSAvoiddevice-to-pad alignment

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

Instead of arranging micro devices uniformly across the entire donor substrate, the substrate is segmented into distinct arrays corresponding to different pad locations. Each array is precisely positioned and configured to align with its specific pad type, ensuring high alignment precision while maintaining high device quantity through optimized spatial distribution.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS11892497B2Micro device arrangement in donor substrate

Publication Date: 2024.02.06 VUEREAL INC

AI summary

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.